-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueProduction Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Book Summary: The Printed Circuit Assembler’s Guide to…Process Validation
December 19, 2019 | I-Connect007 Editorial TeamEstimated reading time: 1 minute

The latest book in I-Connect007’s The Printed Circuit Assembler’s Guide to… series is authored by Gen3’s Graham Naisbitt. With his deep background in process validation and standards work, Naisbitt is uniquely qualified to explore achieving acceptable electrochemical reliability using both CAF and SIR testing. This eBook is a perfect present for the holidays.
Given the current trends toward smart infrastructures, industrial internet of things (IIoT), and connected and electric vehicles, it stands to reason that electronic circuit boards are now deployed into humid and potentially corrosive environments to a greater extent than ever before. In these harsh environments, electronics are at greater risk of electrochemical migration (ECM) failure.
Naisbitt begins The Printed Circuit Assembler’s Guide to… Process Validation with an outline of the history of contamination testing. The book’s two main technical sections then explore SIR and CAF test models for insulation resistance testing, and how to achieve Six Sigma with ionic contamination process controls.
According to peer reviewer Dr. Lothar Henneken, senior expert and six sigma blackbelt, automotive electronics at Robert Bosch GmbH, “This book is an excellent reflection of the current state of experts' views on the subject. Recent changes in IPC and IEC documents are explained in an understandable way. Many misinterpretations and emotional views, especially on ionic contamination measurement, are cleared up in a simple manner.”
Mike Cummings, a technical director at TSI, adds, “Well-written and easy to follow, this dedicated book focuses on the importance of cleaning and decontamination of electronic circuits before application. This topic is timely and important.”
The Printed Circuit Assembler’s Guide to…Process Validation is a must-read for those in the industry who are concerned about ECM and want to adopt a better and more rigorous approach to ensuring electrochemical reliability.
Download your free copy today! You can also view other titles in our full library.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.