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Current IssueEngineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
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Columnist Istvan Novak Nominated for Engineer of the Year
December 23, 2019 | Andy Shaughnessy, Design007Estimated reading time: Less than a minute
Design007 Magazine columnist Istvan Novak, a principal signal and power integrity engineer with Samtec, has been nominated for the DesignCon Engineer of the Year award.
Istvan has been working with PCBs since he built a circuit board out of Bakelite as a youngster. He is a long-time member of the DesignCon Technical Program Committee and an IEEE Life Fellow with 25 patents.
Voting is open until noon Pacific time on December 27. Send Istvan a holiday greeting by casting your vote for him today!
To cast your vote, click here.
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SMTA: Capital Chapter & Connecticut Chapter Joint Technical Webinar
11/12/2024 | SMTAThe SMTA Capital Chapter is co-hosting a free webinar for SMTA members with the SMTA Connecticut Chapter on Tuesday, November 19 at 11:00 a.m. EST.
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Indium Announces InnoJoin as Exclusive Global Sales Partner for NanoFoil®
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Flexible Thinking: Musings on High Density Interconnections
10/30/2024 | Joe Fjelstad -- Column: Flexible ThinkingPeople have been using high density interconnection (HDI) technology since the early 1980s, although it was not called HDI until the late 1990s. In the 1970s, ’80s, and early ’90s, engineers used HDI methods to develop hybrid circuits, which were later referred to as multichip modules (MCMs). These were arguably the first instantiation of heterogeneous interconnection technology, which has been the industry buzzword for almost a decade. These devices are a way of integrating multiple chips—both integrated circuits and discrete devices (resistors, capacitors, and inductors)—into a single package, typically using ceramic substrates with layers of insulation and metallic inks (often gold) and firing them at high temperatures.