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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Columnist Istvan Novak Nominated for Engineer of the Year
December 23, 2019 | Andy Shaughnessy, Design007Estimated reading time: Less than a minute

Design007 Magazine columnist Istvan Novak, a principal signal and power integrity engineer with Samtec, has been nominated for the DesignCon Engineer of the Year award.
Istvan has been working with PCBs since he built a circuit board out of Bakelite as a youngster. He is a long-time member of the DesignCon Technical Program Committee and an IEEE Life Fellow with 25 patents.
Voting is open until noon Pacific time on December 27. Send Istvan a holiday greeting by casting your vote for him today!
To cast your vote, click here.
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