-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Technica USA to Distribute Meyer Burger’s Inkjet Soldermask Technology in North America
January 6, 2020 | Technica USAEstimated reading time: 1 minute

Technica USA has announced that they had reached a Master Distribution Agreement with Meyer Burger to promote and support Meyer Burger's inkjet soldermask technology based on "PiXDRO JETx" systems.
Meyer Burger is a leading global technology company specializing in innovative systems and processes with its competencies and technologies in the photovoltaics, semiconductor, optoelectronic and other high-tech industries like the printed circuit board (PCB) industry. The company has successfully developed the inkjet soldermask technology over the last couple of years.
Frank Medina, President of Technica USA stated, “The PiXDRO JETx rounds out the product offering we have to assist our customers in the area of soldermask application and imaging. Meyer Burger has been very active in developing and perfecting this technology for soldermask for quite some time. I am familiar with their success in the solar cell manufacturing market based on our own involvement in this market. For this reason, we believe they will be a major supplier in the PCB industry as well.”
Ernst Gockel, General Manager of Meyer Burger Netherlands commented, “We are happy to have partnered with an experienced distributor like Technica. They have vast knowledge of the PCB process and are positioned well to provide the proper sales and service support for our product line in this market.”
Medina added, “Both companies are excited about the opportunity to work together and expand the Meyer Burger footprint in the North American market”.
Technica will be exhibiting a PiXDRO JETx system at its booth during IPC 2020 in Hall D Booth # 4423.
About Technica USA
Technica, USA provides the highest quality equipment and process materials, manufactured worldwide, for the printed circuit board fabrication and SMT assembly markets. For more information on Technica, USA, please contact Jason Perry at 1-408-240-5950 or visit our web site at www.technica.com
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Intel Announces Key Leadership Appointments to Accelerate Innovation and Strengthen Execution
09/09/2025 | Intel CorporationIntel Corporation today announced a series of senior leadership appointments that support the company’s strategy to strengthen its core product business, build a trusted foundry, and foster a culture of engineering across the business.
DARPA, State of New Mexico Establish Framework to Advance Quantum Computing
09/08/2025 | DARPAAs part of the Quantum Benchmarking Initiative (QBI), DARPA signed an agreement with the State of New Mexico’s Economic Development Department to create the Quantum Frontier Project.
LPKF Strengthens LIDE Technology Leadership with New Patent Protection in Korea
09/04/2025 | LPKFLPKF Laser & Electronics SE today announced that its groundbreaking LIDE (Laser Induced Deep Etching) technology has received additional patent protection in Korea through the Korean Patent Office (KPCA), effective September 1, 2025.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
CEE PCB Launches PCBpedia: A New Knowledge Hub for Circuit Board Technology
09/03/2025 | CEE PCBCEE PCB, a leading manufacturer of PCBs and FPCs, is responding to the growing demand for reliable technical knowledge. With PCBpedia, CEE introduces a new knowledge platform featuring expert articles on key topics in circuit board technology – from FPC design rules to surface finishes.