-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueEngineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Technica USA to Distribute Meyer Burger’s Inkjet Soldermask Technology in North America
January 6, 2020 | Technica USAEstimated reading time: 1 minute
Technica USA has announced that they had reached a Master Distribution Agreement with Meyer Burger to promote and support Meyer Burger's inkjet soldermask technology based on "PiXDRO JETx" systems.
Meyer Burger is a leading global technology company specializing in innovative systems and processes with its competencies and technologies in the photovoltaics, semiconductor, optoelectronic and other high-tech industries like the printed circuit board (PCB) industry. The company has successfully developed the inkjet soldermask technology over the last couple of years.
Frank Medina, President of Technica USA stated, “The PiXDRO JETx rounds out the product offering we have to assist our customers in the area of soldermask application and imaging. Meyer Burger has been very active in developing and perfecting this technology for soldermask for quite some time. I am familiar with their success in the solar cell manufacturing market based on our own involvement in this market. For this reason, we believe they will be a major supplier in the PCB industry as well.”
Ernst Gockel, General Manager of Meyer Burger Netherlands commented, “We are happy to have partnered with an experienced distributor like Technica. They have vast knowledge of the PCB process and are positioned well to provide the proper sales and service support for our product line in this market.”
Medina added, “Both companies are excited about the opportunity to work together and expand the Meyer Burger footprint in the North American market”.
Technica will be exhibiting a PiXDRO JETx system at its booth during IPC 2020 in Hall D Booth # 4423.
About Technica USA
Technica, USA provides the highest quality equipment and process materials, manufactured worldwide, for the printed circuit board fabrication and SMT assembly markets. For more information on Technica, USA, please contact Jason Perry at 1-408-240-5950 or visit our web site at www.technica.com
Suggested Items
Aeluma Secures NASA Contract to Advance Quantum Dot Photonic Integrated Circuits for Aerospace and AI Applications
11/25/2024 | ACCESSWIREAeluma, Inc., a semiconductor company specializing in high-performance, scalable technologies for mobile, automotive, AI, defense and aerospace, communication and quantum computing, announced it has been awarded a contract by NASA to develop quantum dot photonic integrated circuits (PICs) on silicon.
Designing for Cost to Manufacture
11/21/2024 | Marcy LaRont, I-Connect007ICAPE's Richard Koensgen, a seasoned field application engineer with a rich background in PCB technology, shares his journey of working with customers and manufacturers through the intricacies of circuit board development and emphasizes the importance of early-stage collaboration with PCB designers. With a focus on tackling the most challenging aspects of PCB design and manufacturing, he discusses everything from layout considerations to the thermal challenges of today's technology when it comes to designing for cost.
OSI Systems Receives $11M Order for Electronic Assemblies
11/21/2024 | BUSINESS WIREOSI Systems, Inc announced that its Optoelectronics and Manufacturing division has received an order for approximately $11 million to provide critical electronic sub-assemblies for a leading-edge healthcare original equipment manufacturer (OEM), known for innovative and specialized medical solutions.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.
NTT, Olympus Joint Demonstration Shows IOWN APN's Low-latency Capability
11/21/2024 | JCN NewswireNTT Corporation and Olympus Corporation announced that, following the start of their joint experiment in March of the world’s first cloud endoscope system which processes endoscopic videos on the cloud, they jointly established a cloud endoscopy system utilizing the IOWN APN technology.