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David Suh Joins YAMAHA IM Group USA as Inspection Product Manager
January 7, 2020 | Yamaha IM AmericaEstimated reading time: Less than a minute
YAMAHA Motor Corporation USA‘s Intelligent Machinery (IM) Division announces the appointment of David Suh to the position of Product Manager for Inspection Products. David, recognized in our industry as an Inspection Process Expert, joins YAMAHA’s North American team of technical sales and service professionals in support of YAMAHA’s SPI, AOI and X-Ray Products.
David is a Persian Gulf War Veteran with 5 years serving as a Blackhawk flight engineer in the US Army. In addition, David brings over 20 years of experience in Electronics Assembly to his new position, with particular expertise in Inspection techniques, test engineering, field service, support, and training, PCB manufacturing, and production equipment sales/support.
In making the announcement, George Babka, Sales General Manager of YAMAHA IM, said, “We’re excited to have David join our growing group of industry experts at YAMAHA. His knowledge and broad-based experience make him a valuable asset to our customers, and we’re delighted to have him on our team.”
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Simon Khesin - Schmoll MaschinenSuggested Items
Global Electronics Association and CalcuQuote, an Elisa Industriq Business, Launch Joint Supply Chain Intelligence Initiative
04/29/2026 | Global Electronics AssociationThe Global Electronics Association and CalcuQuote, Elisa Industriq today announced a partnership to deliver timely, actionable supply chain intelligence for the electronics industry.
Is China Plus One Still Happening in the PCB Industry?
04/28/2026 | Manfred Huschka, Manfred Huschka Management Consulting (Shenzhen) Ltd.For much of the past five years, China Plus One has been shorthand for supply-chain diversification: reducing dependency on mainland China by adding manufacturing capacity elsewhere in Asia. In the PCB industry, however, in early 2026, it is more nuanced. It looks less like a clean geographic shift and more like a layered, capital-intensive rebalancing of global capacity, one that still leaves China deeply embedded at the center.
EDADOC: Building the ‘Neural Hub’ for High-Compute Chips Within a Compact Space
04/28/2026 | ECIOEvery chip to the market must pass a stringent checkpoint before shipment known as ATE testing. Serving as the physical “neural hub” that connects test equipment worth millions of dollars with the device under test, the performance of the ATE test board directly determines the accuracy, efficiency, and final yield of chip testing. Amid the rapid rise of high-compute chips, what extreme challenges is this seemingly small circuit board facing? How is EDADOC addressing industry pain points through its one-stop “design + manufacturing” model?
Meet Emerging Engineer Dennis Donovan, Kratos Space Commercial
04/29/2026 | Michelle Te, I-Connect007Like many of today’s engineers, Dennis Donovan grew up interested in how things worked. He wanted to see what was inside and how to make it better. Now, he has three bachelor’s degrees, is earning his master’s, and works as an electrical engineering technologist. He aspires to work in PCB assembly with a particular focus on aerospace electronics. He’s a sharp, well-spoken young man with an eye on his future.
Call for Abstracts for Third Pan-European Electronics Design Conference
04/27/2026 | Global Electronics AssociationThe German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association are officially opening the Call for Abstracts for the Third Pan-European Electronics Design Conference (PEDC).