Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
AIM to Participate at SMTA Rocky Mountain Expo & Tech Forum
January 10, 2020 | AIM SolderEstimated reading time: 1 minute
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce their participation in the upcoming SMTA Rocky Mountain Expo and Tech Forum taking place on January 23, 2020 at Mile High Stadium in Denver, CO. AIM will highlight their NC273LT low temperature solder paste for bismuth bearing alloys, RX18 and CX18 no clean fluxcored solder wire along with their full line of solder assembly materials.
AIM's NC273LT low temperature solder paste provides assemblers another tool to meet the changing needs of an evolving PCB assembly market. With peak reflow temperatures below 170°C, NC273LT minimizes component and substrate warping, reduces thermal exposure and saves energy. NC273LT paste improves the wetting performance of bismuth alloys to RoHS compliant plating and surface finishes. NC273LT provides long stencil life, excellent transfer efficiencies and minimizes solder balling common to bismuth bearing alloys. When thermal exposure during the assembly process is a limitation, NC273LT is an excellent RoHS compliant replacement.
AIM's RX18 and CX18 continue to achieve unprecedented customer acceptance. Engineered for automated/robotic selective soldering, RX18 promotes thermal transfer, fast wetting and reduces voids/skips. Additionally, RX18 extends solder iron tip life and leaves minimal flux residue. CX18 is an operator friendly, low odor/smoke formula, and speeds soldering performance leaving a clear, electrically safe residue that does not require removal. Further throughput and reliability gains can be realized when CX18 and RX18 are combined with AIM's REL61™ and REL22™ alloys. REL22 improves product survival in extreme thermal exposure operating environments such as under-hood automotive, avionics/aerospace and LED lighting. REL61 is ideally suited for industries which require a cost effective alternative to SAC305 with no loss of processing performance or durability.
To discover all of AIM’s products and services, visit the company at the SMTA Rocky Mountain Expo and Tech Forum for more information and to speak with one of AIM’s knowledgeable staff members.
Share on:
Suggested Items
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
SolderKing’s Successful Approach to Modern Soldering Needs
06/18/2025 | Nolan Johnson, I-Connect007Chris Ward, co-founder of the family-owned SolderKing, discusses his company's rapid growth and recent recognition with the King’s Award for Enterprise. Chris shares how SolderKing has achieved these award-winning levels of service in such a short timeframe. Their secret? Being flexible in a changing market, technical prowess, and strong customer support.