Global Citizenship: Cultural Nuances Around the World
The Government Circuit: Four Things to Know About IPC Advocacy in 2025
Global Sourcing Spotlight: Seven Key Challenges in Offshore Manufacturing
AIM to Participate at SMTA Rocky Mountain Expo & Tech Forum
January 10, 2020 | AIM SolderEstimated reading time: 1 minute
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce their participation in the upcoming SMTA Rocky Mountain Expo and Tech Forum taking place on January 23, 2020 at Mile High Stadium in Denver, CO. AIM will highlight their NC273LT low temperature solder paste for bismuth bearing alloys, RX18 and CX18 no clean fluxcored solder wire along with their full line of solder assembly materials.
AIM's NC273LT low temperature solder paste provides assemblers another tool to meet the changing needs of an evolving PCB assembly market. With peak reflow temperatures below 170°C, NC273LT minimizes component and substrate warping, reduces thermal exposure and saves energy. NC273LT paste improves the wetting performance of bismuth alloys to RoHS compliant plating and surface finishes. NC273LT provides long stencil life, excellent transfer efficiencies and minimizes solder balling common to bismuth bearing alloys. When thermal exposure during the assembly process is a limitation, NC273LT is an excellent RoHS compliant replacement.
AIM's RX18 and CX18 continue to achieve unprecedented customer acceptance. Engineered for automated/robotic selective soldering, RX18 promotes thermal transfer, fast wetting and reduces voids/skips. Additionally, RX18 extends solder iron tip life and leaves minimal flux residue. CX18 is an operator friendly, low odor/smoke formula, and speeds soldering performance leaving a clear, electrically safe residue that does not require removal. Further throughput and reliability gains can be realized when CX18 and RX18 are combined with AIM's REL61™ and REL22™ alloys. REL22 improves product survival in extreme thermal exposure operating environments such as under-hood automotive, avionics/aerospace and LED lighting. REL61 is ideally suited for industries which require a cost effective alternative to SAC305 with no loss of processing performance or durability.
To discover all of AIM’s products and services, visit the company at the SMTA Rocky Mountain Expo and Tech Forum for more information and to speak with one of AIM’s knowledgeable staff members.
Share on:
Suggested Items
Bridging the Gap: Workforce Collaboration in East Texas
02/13/2025 | Cory Blaylock, IPCIPC has partnered with Stephen F. Austin State University's (SFASU) Center for Applied Research and Rural Innovation (CARRI) and the IPC Education Foundation on a transformative project aimed at aligning academic training with real-world demands in electronics manufacturing.
Rehm Thermal Systems Brings Pioneering Manufacturing Technologies to productronica China 2025
02/11/2025 | Rehm Thermal SystemsRehm Thermal Systems will be presenting its further developments in areas such as convection soldering under vacuum, condensation soldering, coating and dispensing in Hall E4 of the Shanghai New International Expo Centre from 26 to 28 March.
Incap Slovakia Enhances SMT Quality with Automated Paste Inspection
02/07/2025 | IncapAt Incap Slovakia, quality and efficiency are at the core of our Surface Mount Technology (SMT) production. To further strengthen process control and minimise defects, we have implemented Automated Paste Inspection (API)—a high-precision system that ensures the accuracy and consistency of solder paste printing.
AIM Solder Acquires the Assets of Canfield Technologies
02/07/2025 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials, is pleased to announce the acquisition of the assets of Canfield Technologies, a renowned producer of high-quality solders and fluxes since 1844.
Delvitech to Officially Present Hybrid AOI + SPI Horus System at IPC APEX EXPO 2025
02/06/2025 | DelvitechDelvitech is happy to announce that it will showcase its groundbreaking Horus system, the industry's first all-in-one AI native platform for both Automatic Optical Inspection (AOI) and Solder Paste Inspection (SPI), at the upcoming IPC APEX EXPO 2025. The event is scheduled from March 18 to 20, 2025, at the Anaheim Convention Center in Anaheim, California.