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Pillarhouse USA Announces Appointment of EAP Sales Rep to Cover Florida
January 22, 2020 | Pillarhouse USA Inc.Estimated reading time: 1 minute
Global manufacturer and supplier of selective soldering systems, Pillarhouse USA, Inc. is pleased to announce the appointment of EAP, to spearhead sales efforts in Florida. Adrian De’Ath, Vice president for Pillarhouse USA Inc stated’ we are thrilled to announce EAP have joined the Pillarhouse sales team, they bring years of sales experience to the table with a comprehensive background in electronics manufacturing, materials, process knowledge.
Pillarhouse is a world leader in the design and manufacturing of selective soldering systems from hand-load (batch) processes to fully automated high-speed lines. Pillarhouse manufactures a wide range of modular and hand load equipment to fit the changing marketing market needs of today.
Electronic Assembly Products, Ltd. (EAP) was established in 2002 with a promise to provide solutions to your process challenges while receiving superior customer service, integrity and professionalism. John Johnson, President commented “Pillarhouse is recognized as a world leading supplier in the selective solder industry and we are very excited to represent them in the Florida market.”
About Pillarhouse International Ltd
Pillarhouse has been a leading force in the selective soldering of today’s modern machines; offering a range of machine options to cover the wide variety and complexity of today’s modern electronics. Our philosophy is to produce high engineering standard products with a focus on innovation and cutting edge development.
With Headquarters in Chelmsford – UK alongside supplementary Manufacturing, Sales/Service facility in Suzhou – China and Sales/Service support in Chicago – USA. Pillarhouse has developed into a Global Company with Sales and Service facilities in over 50 countries.
About EAP Florida.
EAP was established in 2002 in Dayton Ohio. EAP approaches each customer as a partner in solving their process challenges. By finding the right solution, EAP maintains the confidence of its customers, enabling them to act as a trusted extension of their internal resources.
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Brent Fischthal - Koh YoungSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.