Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
ITW EAE to Showcase Multiple New Developments to its Electronics Assembly Equipment at IPC APEX Expo
January 23, 2020 | ITW EAEEstimated reading time: 1 minute
ITW EAE, the Electronic Assembly Equipment division of ITW will be showcasing its latest developments at IPC APEX Expo, February 4-6, 2020 in San Diego. The ITW EAE booth 813 will have MPM, Camalot, Electrovert and Vitronics Soltec Engineers and Applications Experts on hand as well as Sales and Management to answer questions and offer solutions.
MPM will be launching the new Momentum II Elite with a new paste monitoring system featuring temperature monitoring as well as upper and lower limit roll-height monitoring. These new features will improve yield and reduce waste by ensuring proper paste viscosity to avoid bridging and voiding and eliminate insufficient or excess paste volumes. There is also a new user-friendly graphic user interface. MPM will also have the Momentum II BTB on display for a preview of its release.
Camalot will be featuring the new 50-inch dual lane Prodigy dispenser. The dual lane conveyor design allows up to six heat zones which is crucial for underfill applications that require pre and post heat and has a large (400mm x 254mm) capacity. Camalot will also showcase new IR (Infrared) Temperature Sensors. Patent-pending, closed-loop monitoring of the PCB/substrate temperature ensures dispenser process stability and yield improvements for underfill applications.
Electrovert will be demonstrating the new DwellFlex 4.0 variable contact wave solder nozzle. The DwellFlex 4.0 is the first nozzle designed specifically with Industry 4.0 automation in mind. The patent-pending design enables the wave width to be adjusted on-the-fly as variable board types are run through the wave. This ensures solder contact time is optimized for a high-mix of board types without changing conveyor speeds.
Vitronics Soltec will showcase the improved performance of the ZEVAm+ Selective Soldering system with live soldering demonstrations every hour. The ZEVAm+ excels at fine pitch soldering with its ability to solder at an angle and the innovative SDC debridging tool. The Centurion Reflow Soldering System will feature several new options including True N2 to Air Switching, fast cool down for high-mix applications and a new air flow system designed to extract flux contamination out of air environment systems.
ITW EAE has worked with the world’s leading manufacturers in developing equipment that addresses evolving technical challenges such as miniaturization while also meeting the need for higher throughput, yield and performance. Key interface solutions have been developed for Industry 4.0/MES that will lead to improvements in yield, data collection and overall equipment effectiveness.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.