Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
ITW EAE to Showcase Multiple New Developments to its Electronics Assembly Equipment at IPC APEX Expo
January 23, 2020 | ITW EAEEstimated reading time: 1 minute
ITW EAE, the Electronic Assembly Equipment division of ITW will be showcasing its latest developments at IPC APEX Expo, February 4-6, 2020 in San Diego. The ITW EAE booth 813 will have MPM, Camalot, Electrovert and Vitronics Soltec Engineers and Applications Experts on hand as well as Sales and Management to answer questions and offer solutions.
MPM will be launching the new Momentum II Elite with a new paste monitoring system featuring temperature monitoring as well as upper and lower limit roll-height monitoring. These new features will improve yield and reduce waste by ensuring proper paste viscosity to avoid bridging and voiding and eliminate insufficient or excess paste volumes. There is also a new user-friendly graphic user interface. MPM will also have the Momentum II BTB on display for a preview of its release.
Camalot will be featuring the new 50-inch dual lane Prodigy dispenser. The dual lane conveyor design allows up to six heat zones which is crucial for underfill applications that require pre and post heat and has a large (400mm x 254mm) capacity. Camalot will also showcase new IR (Infrared) Temperature Sensors. Patent-pending, closed-loop monitoring of the PCB/substrate temperature ensures dispenser process stability and yield improvements for underfill applications.
Electrovert will be demonstrating the new DwellFlex 4.0 variable contact wave solder nozzle. The DwellFlex 4.0 is the first nozzle designed specifically with Industry 4.0 automation in mind. The patent-pending design enables the wave width to be adjusted on-the-fly as variable board types are run through the wave. This ensures solder contact time is optimized for a high-mix of board types without changing conveyor speeds.
Vitronics Soltec will showcase the improved performance of the ZEVAm+ Selective Soldering system with live soldering demonstrations every hour. The ZEVAm+ excels at fine pitch soldering with its ability to solder at an angle and the innovative SDC debridging tool. The Centurion Reflow Soldering System will feature several new options including True N2 to Air Switching, fast cool down for high-mix applications and a new air flow system designed to extract flux contamination out of air environment systems.
ITW EAE has worked with the world’s leading manufacturers in developing equipment that addresses evolving technical challenges such as miniaturization while also meeting the need for higher throughput, yield and performance. Key interface solutions have been developed for Industry 4.0/MES that will lead to improvements in yield, data collection and overall equipment effectiveness.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.