-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Averatek Announces A-SAP License Agreement with American Standard Circuits
January 28, 2020 | AveratekEstimated reading time: 1 minute
Averatek Incorporated has announced American Standard Circuits as an A-SAP™ licensee. A-SAP™ is an advanced PCB manufacturing technology that enables feature sizes of 25 microns and below, effectively providing PCB designers with new opportunities to address the challenges of next-generation electronics.
“American Standard Circuits' RF expertise—in combination with our long-term, relationship-driven approach to customer development—will serve the PCB design community well as we learn to fully understand all of the possible benefits of this emerging technology. Our goal at ASC is to always be at the forefront of technology, and the A-SAP™ technology allows us to do that once again. We welcome the opportunity to work with the team at Averatek and redefining the future," said Anaya Vardya, president and CEO of American Standard Circuits.
“Averatek is delighted to be working closely with American Standard Circuits” said Haris Basit, CEO of Averatek. “ASC has demonstrated significant capability in high-performance and high-frequency PCBs and Averatek’s ultra-high-density A-SAP™ process represents a strong complementary capability to support next-generation electronics requirements.”
Averatek’s A-SAP™ is an advanced manufacturing process for printed circuit board fabrication with trace and space widths as narrow as 15 microns. This process can dramatically reduce the area, layer count, and weight of electronics systems as well as provide significant RF benefits. A-SAP™ has been designed to be easily integrated with traditional PCB manufacturing equipment and materials.
About Averatek
Averatek Corporation develops and licenses advanced manufacturing processes for a variety of electronic products, including very high-density printed circuit boards, semiconductor packaging, and RF and millimeter-wave passive components. In addition, Averatek develops and sells the key chemistry that enables these advanced manufacturing processes. For more information, visit www.averatek.com.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Boston Semi Equipment Adds New Handler Product Lines to Expand Test and Back-end Manufacturing Product Portfolio
09/09/2025 | Boston Semi EquipmentBoston Semi Equipment (BSE), a global leader in semiconductor test automation solutions, introduced several new product lines under a partnership with a leading semiconductor original equipment manufacturer (OEM) based in Asia.
Sypris Wins Contract for Classified Missile Avionics Program
09/09/2025 | Sypris Solutions Inc.Sypris Electronics, LLC, a subsidiary of Sypris Solutions, Inc., announced that it has received a follow-on contract award to manufacture and test advanced electronic power supply modules for integration into the avionics suite of a classified, mission-critical missile program. Production is scheduled to begin in 2026.
Weaning the U.S. Military Off a Tablet Supply Chain That Leads to China
09/08/2025 | Jim Will, USPAETablet computers are essential to how our military fights, moves and sustains, but these devices are built on a fragile global supply chain with strong ties to China. Building domestic manufacturing to eliminate this vulnerability is feasible if we tap into the information and capabilities that already exist and create strong demand for tablets produced by trusted and assured sources.
Zhen Ding Posts August 2025 Monthly Revenue Report
09/08/2025 | Zhen DingZhen Ding Technology Holding Limited, a global leading PCB manufacturer, today reported August 2025 revenue of NT$14,651 million, up 9.13% MoM and down 17.75% YoY.
Kitron Reports Initiation of Share Buyback Program
09/08/2025 | KitronKitron ASA has decided to initiate a share buyback program of up to 16,000 of its own shares for a total maximum amount of NOK 900,000. The buyback program may be carried out in the period from this announcement and until 12 September 2025.