Powering the Future: Why True Ceramic Circuits Are Not Just ‘Better PCBs’
Global Sourcing Spotlight: The Global Quality Gap—Why Consistency Wins the Contract
Knocking Down the Bone Pile: Precision Milling of Underfilled SMT Components
Highly Accelerated Thermal Shock (HATS™) High Speed Via Reliability test systems have now been updated with HATS²™ Technology. These updates provide HATS™ test systems with a wider temperature range (-55°C to 265°C), an improved measurement subsystem capable of high-current, micro-ohm precision, 4-wire resistance measurements and the ability to perform Multiple Cycle Convection Oven Reflow Simulation with in-situ resistance measurements in accordance with IPC-TM-650 Method 2.6.27B. This update also allows HATS™ test systems to test up to 72 IPC-2221B Type "D" coupons and 36 Traditional HATS™ or new HATS²™ Single Via coupons for both Multiple Cycle Convection Oven Reflow Simulation and Thermal Shock/Cycling.
The patented HATS²™ Single Via Test Coupon contains 7 Single Via Nets. Each of these Single Via Nets can be replaced by a daisy-chain net. This allows an updated HATS™ unit to collect electrical resistance data from both Single Via and Daisy-chain test nets for the via structures on the coupons.
According to Bob Neves, Microtek Laboratories China CTO/chairman, “Designers can include 1 or 2 daisy-chain nets along with 5-6 single via nets on the same HATS²™ Single Via Test Coupon. This should provide a bridge between traditional daisy-chain and single via net test results.”
For more information about HATS² Technology or the patented* HATS²™ Single Via Test Coupon, please visit HATS-Tester.com.
