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JAVAD EMS Install Additional Juki High-Speed Mounter
January 29, 2020 | JAVAD EMSEstimated reading time: 1 minute
AVAD EMS (JEMS), a leading global EMS company that provides low to medium volume, high-mix applications, announces that it has installed a KE-3020VXL High Speed Flexible Mounter. JEMS is a long-standing Juki customer, adding this system to its existing four Juki lines.
The KE-3020VXL offers JEMS improved flexibility and production quality. It supports both electronic and mechanical tape feeders and can handle boards up to 22" x 24". With its multi-nozzle (six nozzles) laser head, the KE-3020 can achieve a rated IPC9850 speed of 17,100CPH and is capable of a component placement range from 01005 (0402 metric) to 74mm2.
Gary Walker, Vice President of JEMS stated: “The need for this new large format machine was precipitated by the awarding of a new PCBA going into production from an existing customer. The new product is 21" x 22.5", 0.277" thick, more than 50 layers, and just under 15,000 component placements with nearly 87,000 total solder joints including 12 BGAs that are 55mm x 55mm with 2,892 balls each. We already build some very large and complex PCBAs for multiple customers but this new product will take that complexity factor to a whole new level.”
JEMS has more than 40,000 ft.2 manufacturing space in the heart of Silicon Valley, which it continually updates to the highest standards of electronic manufacturing services, communication, client support, employee comfort, and training. The company’s surface-mount-technology (SMT) lines are complete with inline three-dimensional (3D) solder paste inspection and AOI complimented by fully automated 3D X-ray system for solder joint inspection.
JEMS’ manufacturing lines are highly flexible, allowing for diverse and complex products using the latest in component packaging technologies to be assembled and with quick changeover between products, enabling high-mix, low to medium volume production.
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12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
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Advancing Photonic Soldering
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Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
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