-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Spotlight on Mexico
Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
MacDermid Alpha’s ALPHA OM-550 Solder Paste to be Demonstrated by Vermes Microdispensing at IPC APEX EXPO
February 3, 2020 | MacDermid Alpha Electronics SolutionsEstimated reading time: 2 minutes
MacDermid Alpha Electronics Solutions, leaders in innovative electronic interconnect technologies, will have its revolutionary low temperature solder paste, ALPHA OM-550 HRL1 demonstrated by Vermes Microdispensing on their latest solder paste jetting dispense system, MDS 1560 with DST(Dynamic Shockwave Technology), during this year’s IPC APEX EXPO Conference and show, February 1-6, in San Diego, California.
Vermes Microdispensing, a world leader in the design and manufacture of advanced microdispensing systems, has had considerable success with jet dispensing the ALPHA OM-550 HRL1 solder paste and will be running this paste using its MDS 1560 jetting head in Booth #1602. “We are excited with the success Vermes has had with our latest generation of low temperature solder paste,” said Paul Salerno, Global SMT Portfolio Manager at MacDermid Alpha Electronics Solutions. “Customers will be pleased with the performance of this paste in a jet dispensing application.”
Alpha, a brand of MacDermid Alpha Electronics Solutions, is a leader in innovative materials for electronics assembly. In addition to the suite of Alpha materials for low temperature assembly solutions, the new ALPHA HiTech™ Adhesives and Encapsulants, Void Reduction Solutions (VRS), and range of materials for automotive assemblies will be promoted.
To learn more about MacDermid Alpha’s solutions to optimize component reliability and assembly visit us during IPC APEX at Booth #1824 or visit MacDermidAlpha.com
About Vermes Microdispensing
Headquartered in Germany, VERMES Microdispensing revolutionized microdispensing technology with the introduction of its contact free piezo-based MDS 3000 series in 2001. Today, the company is a world leader in the design and manufacture of innovative microdispensing concepts and systems for adhesives, silicones, greases, solvents and other fluids. VERMES high precision MDS 3000 valves support modern manufacturing processes across the globe. Their systems enable our customers to achieve contact free dispensing of highly viscous media droplets in the micro and nano-liter range at theoretical frequencies of more than 3000 Hz; a rate that is unique in the industry. Find out more at vermes.com.
About MacDermid Alpha Electronics Solutions
Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, and MacDermid Enthone brands, we provide solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find out more at MacDermidAlpha.com.
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.