‘A Night of Happy-ness’ and 2020 Good for the Industry Awards
February 4, 2020 | I-Connect007 Editorial TeamEstimated reading time: 2 minutes
The Horton Grand Hotel in San Diego was the site of “A Night of Happy-ness” on the evening of Monday, February 3, 2020. I-Connect007 transformed the Regal Ballroom into a cozy lecture hall with two key objectives: to award the I-Connect007 Good for the Industry awards, and to celebrate the life, achievements, and personality that is industry pioneer Happy Holden.
The evening started with cocktails and appetizers. Barry Matties served as master of ceremonies, setting the mood with a mix of humor and sincerity.
The headliner of the evening was Happy Holden, who shared his memories and reminiscences growing up, as a student at Oregon State University, and then as a true pioneer at Hewlett-Packard. Happy’s career brought him in contact with virtually every other luminary in the electronics and computer segments. Happy kept the crowd captivated with funny stories and interesting asides, right up to the scheduled Q&A session.
I-Connect007 was also pleased to announce the recipients of this year’s prestigious Good for the Industry Award. I-Connect007 columnists from various industry segments—including Design007, PCB007, SMT007, and Flex007—were recognized and celebrated for sharing their knowledge and expertise with the industry. This year’s recipients each contributed a minimum of 50 columns, articles, interviews, etc., since becoming I-Connect007 columnists.
Publisher Barry Matties said, “At I-Connect007, we believe being good for the industry means helping the industry improve cycle time, lower cost, increase yields, build better products, increase profitability, reduce waste, become overall more efficient, do things differently, and motivate and inspire others to do the same—all things that are good for the industry. These are things that we strive to do in our own business every day.”
Kiersten Rohde, I-Connect007 editor and columnist coordinator, stated, “It was an honor to recognize these columnists and all the work they have contributed to the industry over many years. They're an incredible group of industry experts and I greatly respect their commitment to education and knowledge-sharing.”
The entire I-Connect007 team congratulates these recipients and thanks them for being good for the industry.
>Check out photos from this event at our Real Time with... IPC APEX EXPO 2020 site.
800+ Contributions
- Dan Beaulieu – “It’s Only Common Sense” – D.B. Management Group – PCB007
150+ Contributions
- Dominique K. Numakura – “EPTE Newsletter” – DKN Research – Flex007/PCB007
100+ Contributions
- Barry Olney – “Beyond Design” – In-Circuit Design (iCD) – Design007
- Steve Williams – “The Right Approach” – The Right Approach Consulting – PCB007
50+ Contributions
- Michael Carano – “Trouble in Your Tank” – RBP Chemical Technology – PCB007
- John Coonrod – “Lightning Speed Laminates” – Rogers Corporation – Design007
- Tara Dunn – “Flex Talk” – Omni PCB – Flex007/PCB007
- Joe Fjelstad – “Flexible Thinking” – Verdant Electronics – Flex007
- Michael Ford – “Smart Factory Insights” – Aegis Software – SMT007
- Jennie S. Hwang – “SMT Perspectives and Prospects” – H-Technologies Group – SMT007
- Tom Kastner – “Punching Out!” – GP Ventures – PCB007
- Istvan Novak – “Quiet Power” – Samtec – Design007
- Ray Prasad – “SMT Solver” – Ray Prasad Consultancy Group – SMT007
- Mark Thompson – “The Bare (Board) Truth” – Prototron Circuits – Design007
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
SEMI Foundation Honors Applied Materials at SEMICON West with 2025 Excellence in Achievement Award for Talent Development
11/04/2025 | SEMIThe SEMI Foundation announced it recognized Applied Materials, Inc. with the Excellence in Achievement Award at SEMICON West 2025 in Phoenix, Arizona, honoring the company’s outstanding leadership and collaboration in building the next generation of semiconductor talent.
Update: Technica USA Begins Exclusive U.S. Distributor for DCT Cleaning Products
11/03/2025 | Technica USATechnica USA is pleased to announce they have begun shipping product for DCT USA, LLC today. Technica recently announced a strategic partnership as the exclusive master distributor of DCT cleaning products in the United States, which became effective November 1, 2025.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
Real Time with... SMTAI 2025: Navigating Manufacturing Challenges with Akrometrix
11/03/2025 | Real Time with...SMTAIMarcy LaRont and Paul Handler of Aktrometrix share insights from the SMTAI show in Chicago. They address manufacturing challenges, particularly warpage issues, and discuss Akrometrix's solutions. Paul details three optical technologies for measuring warpage and thermal expansion, emphasizing the need for reliability and defect detection in production. The conversation also touches on new industry standards for board warpage, influenced by OEMs.
I-Connect007 Welcomes New Columnist: Leo Lambert, EPTAC
10/30/2025 | I-Connect007I-Connect007 is excited to announce a column by Leo Lambert, an industry veteran with 40 years of experience, an award winner, and technical director at EPTAC. This column, Learning With Leo, will explore the evolution and related challenges of electronics product assembly, especially as it relates to training.