The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
Dow Introduces First Solventless Silicone Conformal Coating
February 6, 2020 | DowEstimated reading time: 2 minutes
Dow (NYSE: Dow) introduced today at IPC APEX EXPO 2020 new DOWSIL™ CC-8030 UV and Moisture Dual Cure Conformal Coating, the industry’s first solventless silicone conformal coating with an ultraviolet (UV) and moisture dual cure system for high throughputs. This new environmentally responsible silicone technology promotes sustainability, health and safety while reducing processing costs through automated spraying and fast, energy-efficient UV curing. Other silicones support UV curing, but none are conformal coatings with a low enough viscosity for spray coating and with a secondary moisture cure for shadowed areas. The new DOWSIL™ product also offers more reliable protection against stress and thermal cycling versus competitive materials.
Brian J. Chislea, senior electronics application engineer at Dow, will discuss the new DOWSIL™ CC-8030 UV and Moisture Dual Cure Conformal Coating during two poster sessions at IPC APEX EXPO. The first session is scheduled for today, Tuesday, Feb. 4, from 10:00 to 10:30 a.m. Pacific Standard Time (PST). The second is scheduled for Wednesday, Feb. 5, from 4:30 to 5:00 p.m. PST.
“Dow has long been an innovative leader and developer of leading-edge conformal coating technologies that address our customers’ most pressing needs,” said Chislea. “DOWSIL™ CC-8030 Coating is an excellent example of this. “By listening closely to our customers, we responded with this first-of-its-kind material that can help electronics manufacturers meet their sustainability and productivity goals, and more.”
DOWSIL™ CC-8030 UV and Moisture Dual Cure Conformal Coating is an environmentally progressive solution for protecting rigid printed circuit boards (PCBs), sensitive electronic components and fine-pitch designs from environments with airborne contaminants. This high-performance silicone conformal coating is formulated without benzene, toluene, ethylbenzene or xylene (BTEX) solvents. The new DOWSIL™ Conformal Coating also has a low modulus for delicate components and high elongation for reliable protection against stress. To provide an even greater level of PCB protection, DOWSIL™ CC-8030 UV and Moisture Dual Cure Conformal Coating can be applied in multiple layers. Compared to leading acrylated urethane UV cure coatings, the new silicone-based Dow technology provides superior protection against thermal cycling.
A soft, medium-viscosity silicone, DOWSIL™ CC-8030 UV and Moisture Dual Cure Conformal Coating has a rheology that is designed for high-throughput spray coating. Its dual cure technology combines speed with completeness of coverage for reduced work-in-process inventory. With UV curing from a standard mercury broad spectrum lamp at 300 mW/cm^2, the DOWSIL™ coating is tack-free after less than 10 seconds. Compared to thermal ovens that cure in minutes, UV ovens are also smaller and consume less energy. Further, the new coating’s secondary alkoxy moisture curing reaches any shadowed areas where UV light can’t penetrate, or UV curing is otherwise incomplete. Moisture curing also supports thicker coating and won’t add stress from thermal cycling.
DOWSIL™ CC-8030 UV and Moisture Dual Cure Conformal Coating is available globally.
Share on:
Suggested Items
IPC Announces New Training Course: PCB Design for Military & Aerospace Applications
12/23/2024 | IPCIPC announced the launch of a new training course: PCB Design for Military & Aerospace Applications.
Zhou (Peter) Guoyin: Pioneering the Standardization of ESG
12/23/2024 | Chuck Li, IPC AsiaWith more than 30 years of experience in corporate social responsibility (CSR) and environmental, social, and governance (ESG), Zhou (Peter) Guoyin has not only witnessed the evolution of CSR and ESG globally but has also been a key force in driving their development. As chair of the IPC-1401 standard committee, Zhou has led numerous innovative projects over the past 11 years and was awarded the SEDEX Supply Chain Impact Award in August 2024. In this exclusive interview, he shares valuable insights into the ESG field and the profound impact of IPC-1401 on the electronics manufacturing industry.
Are Our Stackup Rules No Longer Valid?
12/19/2024 | Cherie Litson, EPTAC MIT CID/CID+Are the stackup rules we used to follow no longer valid? It depends on what you’re designing. Electrical rules change depending on your circuit. Fabrication rules change depending on which fabricator you’re working with. Today, we just have more options, and sometimes, cost is a bigger rule than anything else. If you search online for information about layer stackups, trace widths, and hole sizes in PCBs, you’ll find a variety of resources.
IPC/WHMA Launches Groundbreaking Online Course on Wire Harness Design
12/18/2024 | IPCIPC/WHMA is excited to announce the launch of its new online instructor-led training course, "Introduction to Wire Harness Design I," available now through the IPC EDGE Learning Management System.
IPC Releases Latest List of Standards and Revisions
12/17/2024 | IPC Community Editorial TeamEach quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q4 2024.