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American Standard Circuits to Exhibit at Focus on PCB 2024 Italy

05/09/2024 | American Standard Circuits
American Standard Circuits will be exhibiting at this year’s Focus on PCB Italy 2024 to be held on May 15 and 16 at the Vicenza Expo Centre, Vicenza, Italy.

UHDI Fundamentals: ASC Sponsors Ultra High Density Interconnect Symposium 

03/21/2024 | Anaya Vardya, American Standard Circuits
American Standard Circuits (ASC) is a major sponsor of an upcoming symposium on one of the most talked about new technologies that has come along in quite a while: ultra high density interconnect (UHDI).

PCBAA Welcomes CHIPS Program Investing in American Made Substrates

03/05/2024 | PCBAA
The Printed Circuit Board Association of America welcomes the CHIPS for America program action to make available $300 million via a Notice of Funding Opportunity (NOFO) for domestic research and development activities to accelerate domestic capacity for advanced packaging substrates and substrate materials.

ASC Sunstone Proudly Sponsors SMTA’s Ultra High-Density Interconnects (UHDI) Event

02/27/2024 | ASC Sunstone
ASC Sunstone, a leading provider of high-quality printed circuit board (PCB) solutions, is pleased to announce its sponsorship of the upcoming Ultra High-Density Interconnects (UHDI) event hosted by the Surface Mount Technology Association (SMTA). The event, titled "Advancements in HDI: Driving Innovation Forward," will serve as a platform for industry professionals to explore the latest trends and technologies in high-density interconnects.

Todd Rountree Assumes the Role of CEO at Austin American Technology

02/19/2024 | Austin American Technology (AAT)
Austin American Technology (AAT) proudly announces the appointment of Todd Rountree as Chief Executive Officer (CEO). With nearly 8 years of dedicated service as President and COO, Rountree brings a wealth of experience and a proven track record of leadership to his new role.
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