-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueEngineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
15th ECWC Call for Papers: "Bridging Technology Sharing Innovation"
February 11, 2020 | IPCEstimated reading time: 1 minute
Abstracts are due for the 15th Electronic Circuits World Convention.
The 15th Electronic Circuits World Convention (ECWC15) is the most notable international PCB symposium held every three years in different cities around the world. In the last 40 years, members of the World Electronics Circuit Council (WECC) have taken turns to host this conference.
HKPCA is honored to host ECWC15 in 2020. The conference is scheduled to begin in Hong Kong on November 30, 2020 and conclude at the international Electronics Circuit Exhibition in Shenzhen on December 2, 2020.
The ECWC15 team seeks local and international papers for this event.
To submit an abstract
1. Download the ECWE15 Abstract Submission Form.
2. Email your abstract to ecwc15@hkpca.org as soon as possible.
If your abstract is selected, your paper could be selected by the ECWC15 program committee to receive the ECWC15 Best Paper Award. The awards ceremony will take place on December 2, 2020.
Topics of interest for ECWC15 are in the areas of Management and Technology. The following are some example subjects within each of these discipline areas.
Technology
- Design and Development Tools—Materials, Components and Traceability
- Manufacturing—(Equipment, Technology, Process Development, Automation)
- Quality, Test and Life Cycle Management
- PCB Processes—(Chemical Technology, Mechanical Technology, Optical Technology)
- Packaging Technology—(System in Packaging, Wafer-Level Packaging, Panel-Level Packaging)
- Surface Mounting, Assembly and Interconnection
- Energy Harvesting/Green Energy
- Application-specific Areas—(Automotive Electronics and Electromobility, Industrial and Power Electronics, Aerospace and Defense, Medical Electronics, Consumer Electronics)
- Advanced and Emerging Technologies—5G requirements on PCBs
- Smart Living Applications—E-Textiles/Smart Textiles—Printed Electronics/Printed Hybrid
Management
- Global Market Trends and Outlook—Supply Chain Management
- Environment, health and Safety—Business Models and Strategy
- Certification and Qualifications—Total Cost of Ownership and Overall Equipment Efficiency (OEE)
- Industry 4.0/Smart Manufacturing—Traceability/Blockchain
Please send your questions about the call for abstracts to mandawong@hkpac.org or amandali@hkpca.org.
Suggested Items
PCB Design Software Market Expected to Hit $9.2B by 2031
11/21/2024 | openPRThis report provides an overview of the PCB design software market, detailing key market drivers, challenges, technological advancements, regional dynamics, and future trends. With a projected compound annual growth rate (CAGR) of 13.4% from 2024 to 2031, the market is expected to grow from USD 3.9 billion in 2024 to USD 9.2 billion by 2031.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.
IPC Celebrates National Apprenticeship Week with a Focus on Electronics Manufacturing Excellence
11/19/2024 | IPCIPC, a leading global electronics industry association and source for industry standards, training and advocacy, is proud to announce its participation in National Apprenticeship Week, scheduled for November 17-23, 2024.
IPC Introduces First Standard for In-Mold Electronics
11/18/2024 | IPCIPC announces the release of IPC-8401, Guidelines for In-Mold Electronics. IPC-8401 addresses in-mold electronics (IME) technology, providing industry consensus on guidelines for manufacturing processes, part structures, material selection, and production test methods to integrate printed electronics and components into 3D smart structures.
Disruptive Innovation and Generative AI Inventor, Kevin Surace, to Keynote IPC APEX EXPO 2025
11/15/2024 | IPCEach year, IPC APEX EXPO features industry’s most dynamic, innovative minds to deliver keynote presentations that are both educational and entertaining. IPC APEX EXPO 2025 will feature Kevin Surace, an internationally renowned futurist and generative artificial intelligence (AI) innovator.