-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Spotlight on Mexico
Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Rehm Thermal Systems Wins the NPI Award
February 12, 2020 | Rehm Thermal SystemsEstimated reading time: 2 minutes
Successful trade fair appearance at the IPC APEX EXPO—Vision TripleX recognised with the NPI Award.
The trade fair year 2020 got off to a roaring start for Rehm Thermal Systems: The company’s participation in the IPC APEX EXPO, one of the most important trade shows for the American electronics industry, was accompanied by winning an NPI Award in the “Soldering−Reflow” category. The manufacturer of thermal system solutions delivered a convincing performance with Vision TripleX—a soldering system which was presented for the first time last November at productronica 2019 in Munich, and which combines the advantages of convection and vapour phase soldering.
“IPC APEX EXPO was a full-blown success for us. By presenting our systems—the coating system ProtectoXC as well as the vapour phase soldering system CondensoXC—we successfully captured the interest of many visitors which led to a number of stimulating discussions. The fact that we won the NPI Award for our Vision TripleX was a great way to round off our trade show appearance in San Diego. For us, the IPC APEX EXPO in San Diego is one of the most important trade shows we have attended for many years,” explains Carsten Kramer, Managing Director of Rehm Thermal Systems USA.
With Vision TripleX, Rehm was able to win over the jury and claim the NPI Award for itself: The newly developed Vision TripleX is based on the reflow convection soldering systems of the Vision series and combines the convection soldering process with the proven vapor phase soldering process of the Condenso series. Thus, three different processes can be operated in this new system: reflow convection soldering with and without vacuum and vapour phase soldering using Galden®. This not only affords customers greater flexibility in the production of electronic assemblies while saving on investment costs and space in the production facility. The flexibility of temperature profiling—resulting from the combination of convection and condensation, in conjunction with the applicable atmosphere (air, N2 and/or Galden®)—allows high-quality solder joints to be realised on assemblies that vary greatly in thermal mass.
About Rehm Thermal Systems
Rehm is a technology and innovation leader in the state-of-the-art, cost-effective manufacturing of electronic assembly groups. It specialises in thermal system solutions for the electronics and photovoltaics industry. Rehm is a globally active manufacturer of reflow soldering systems using convection, condensation or vacuum, drying and coating systems, functional test systems, equipment for the metallisation of solar cells and numerous customised systems. We have a presence in all key growth markets and, as a partner with 30 years of industry experience, we are able to implement innovative production solutions that set new standards.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.