Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
I-Connect007 Publishes Third Annual Show & Tell Magazine All About IPC APEX EXPO 2020
February 19, 2020 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
Welcome to the third annual Real Time with… IPC APEX EXPO 2020 Show & Tell Magazine.
This special publication is a supplement to our other monthly magazines and brings you exclusive, in-depth coverage of the recent event. These pages are packed with tons of great content, including event photos, video interviews, attendees’ thoughts, reviews from our guest contributors and I-Connect007 editors, interviews with award winners and other industry experts, and coverage of another successful IPC STEM Student Outreach Program.
If you couldn’t make it to San Diego, don’t worry. This edition of Show & Tell Magazine brings you coverage of the entire show, including “A Night of Happy-ness” with Happy Holden, I-Connect007’s Good for the Industry Award recipients, keynote presentations by Burt Rutan and Elaine Larsen, and much more.
Download Real Time with… IPC APEX EXPO 2020 Show & Tell Magazine here.
Also, be sure to visit Real Time with...IPC APEX EXPO 2020 for detailed video interviews and photo coverage of this year's show. See a photo you'd like to share? Go ahead and download it from our gallery. Please give us credit or a link to our Real Time with... site if you choose to post it on your site or social media page.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
TTM Technologies Receives Two Awards from the Global Electronics Association at the 2025 IPC CEMAC Conference
11/03/2025 | Globe NewswireTTM Technologies, Inc. announced that two of its team members received prestigious Asia Steering Committee Outstanding Service Awards from the Global Electronics Association (formerly named IPC connecting global electronics industry) at the 2025 IPC CEMAC Electronics Manufacturing Annual Conference in Shanghai.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.
Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.