Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
2019 Brought Record Sales to Hentec Industries
February 20, 2020 | Hentec Industries Inc.Estimated reading time: 1 minute
Hentec Industries, (formerly RPS Automation) a leading US manufacturer of selective solder, lead tinning, and solderability testing equipment, hit record sales in 2019 with the guidance of National Sales Director Tom Baro and the Torenko & Associates team.
Hentec Industries was able to surpass previous year’s sales records in 2019, with the assistance of Tom Baro and his 20+ years of sales experience. He has continued to develop and maintain relationships with independent sales representatives like Ron Torenko, from Torenko & Associates. In turn, this has created many long lasting business relationships, as well as skyrocketing Hentec’s sales in 2019.
During the 2020 IPC APEX Expo in San Diego, Ron Torenko and his team were named Hentec Industries’ Sales Team of the Year for 2019. Torenko & Associates has grown to be one of the top SMT manufacturer representatives in the United States, and only partners with premier electronic equipment manufacturers. The Torenko team is based out of Dallas, TX and their sales region covers Texas, Arkansas, Oklahoma, Louisiana, and Mexico. Torenko & Associates has a simple mission statement: to provide you with the best assembly solutions available and at the best price.
About Hentec Industries
Hentec Industries/RPS Automation is a manufacturer of automated selective soldering, lead tinning, and component test equipment for electronics and component manufacturing, assembly, and distribution. Hentec has been advancing automated lead finish and soldering technology for defense, aerospace, automotive, contract manufacturers and micro-electronics component manufacturers for over 25 years. Hentec products are designed and manufactured in the USA.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.