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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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EnviroLeach Announces Positive Production-Level Testing for Jabil at its Vancouver Facility
February 24, 2020 | EniviroLeachEstimated reading time: 1 minute
EnviroLeach Technologies Inc. (the "Company" or "EnviroLeach"), is pleased to announce positive preliminary results from comprehensive full-scale recycling tests conducted at Enviroleach's electronic waste (E-Waste) processing facility in Vancouver on over 60,000 lbs of electronic components and printed circuit boards supplied by Jabil. These full-scale production tests follow the previously announced chemical and formula evaluations performed at Jabil's Memphis facility in 2018 and 2019.
A wide variety of materials including, set-top boxes, modems, cell phones, switches, and printed circuit boards were processed. The resulting individual material fractions and metal-rich solutions were analyzed to determine metal grades, purity, recoverability, and commercial value. Preliminary results indicate all end products meet or exceed industry standards.
Jabil and EnviroLeach are currently negotiating the modification of their existing agreement which may include a strategic partnership to allow for processing a significant quantity of Jabil supplied materials at EnviroLeach's Vancouver facility. This will allow Jabil to immediately leverage EnviroLeach's proprietary formulas and technologies to provide a safe and sustainable alternative for the treatment of end-of-life electronics worldwide.
EnviroLeach's CEO Duane Nelson said, "I am very pleased that the Jabil relationship is evolving into a tangible commercial venture. The impact of this relationship will provide further validation of our process and is expected to result in a significant long-term source of feedstock for our Vancouver facility."
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Sweeney Ng - CEE PCBSuggested Items
Rethinking Reinforcement Materials for Advanced Packaging
05/14/2026 | Ivana Ivanovic-Hesselink, Flexiramics B.V.Materials that once quietly supported the industry are now becoming limiting factors. The electronics industry is experiencing unprecedented pressure as RF systems push into mmWave frequencies, high-speed digital architectures advance into their next performance generation, and power densities climb across automotive, telecom, aerospace, and computing. Reinforcement materials, long treated as a background detail in laminate design, are suddenly at the centre of performance, reliability, and supply‑chain discussions.
Rethinking Stackup, Materials, and Tolerances in Modern Designs
05/14/2026 | Kristin Moyer, Global Electronics AssociationThe simple rectangular rigid PCB is becoming increasingly infrequent. This reality necessitates designing with concepts well outside traditional rigid PCB methodologies. For example, the designer of wearable electronics may need to implement conductive fibers integrated into the textile material. Heads-up displays, like those in VR/AR headsets and glasses, require transparent circuitry etched into the display glass. The process of designing without a rule book usually starts with something other than the traditional board design process.
I-Connect007 Announces Upcoming Issue of Advanced Electronics Packaging Digest
05/13/2026 | I-Connect007The next issue of Advanced Electronics Packaging Digest examines the materials, architectures, and integration strategies shaping the next phase of electronics innovation, from reinforcement materials under thermal and frequency pressure to heterogeneous integration and advanced packaging as a system-level scaling factor.
Indium Experts to Address Data Center Thermal Management and Sintering Standards at SMTA Conference
05/13/2026 | Indium CorporationAs a leading materials provider for the advanced electronic packaging market, Indium Corporation® experts will share their technical insight and knowledge on two critical industry topics—data center thermal management and sintering protocols—at the SMTA Electronics in Harsh Environments Conference, May 19-21, in Amsterdam, Netherlands.
AI Demand Drives PCB Material Market Growth
05/08/2026 | TPCAAs AI computing continues to drive a comprehensive upgrade in hardware specifications, the global printed circuit board industry is undergoing a profound structural transformation.