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ZESTRON Academy Announces 2020 Cleaning Webinar Schedule
February 24, 2020 | ZESTRONEstimated reading time: Less than a minute
ZESTRON Academy, the global leading provider of cleaning process education to the electronics manufacturing and semiconductor industries, is pleased to announce the 2020 Cleaning Webinar Series schedule. ZESTRON Academy continues to educate production line operators, manufacturing and quality control managers as well as process engineers by providing detailed industry knowledge and troubleshooting techniques.
All webinars are FREE of charge, and will be presented by ZESTRON Academy’s accredited experts, Umut Tosun, M.S.Ch.E., Application Technology Manager, Ravi Parthasarathy, M.S.Ch.E., Senior Application Engineer, and Jigar Patel, M.S.Ch.E., Senior Application Engineer.
Featured topics:
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Should You Clean PCBs? (March 26)
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Cleaning Before Conformal Coating (April 23)
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Cleaning with pH Neutral Chemistry (May 28)
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Jet Printing Solder Paste and Cleaning Challenges (June 18)
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Surface Cleanliness Assessment (July 23)
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Defluxing Advanced Packages (August 27)
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Solder Mask and Low Stand-off Component Cleaning—A Connection? (September 17)
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Multiple Thermal Cycles (October 29)
For more information on ZESTRON Academy or to register for our cleaning webinar series, please visit ZESTRON Academy.
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Julia McCaffrey - NCAB GroupSuggested Items
Nolan’s Notes: A Tribute to Iola—and Automation
12/02/2025 | Nolan Johnson -- Column: Nolan's NotesIn the 1960s and ’70s, when the west side of the Portland, Oregon, metro area was dominated by Tektronix, my grandmother worked as one of the “assembly ladies.” Known as “Tek,” the company was an economic juggernaut, driving the economy of the cities of Beaverton, Tigard, and Hillsboro. The only employer larger than Tektronix was the state of Oregon itself; virtually every Portlander had some connection to Tek.
Indium Expert to Tackle Reliability Challenges in AI and High-Performance Computing at EPTC 2025
11/27/2025 | Indium CorporationIndium Corporation Research Metallurgist Huaguang Wang, Ph.D., will deliver a presentation at the 27th IEEE Electronics Packaging Technology Conference (EPTC 2025). The conference will be held December 2-5, 2025, in Singapore.
Altus Supports Concurrent Technologies’ Production Expansion with Advanced Inline Vapour Phase System
11/26/2025 | Altus GroupAltus Group, a leading distributor of capital equipment for the electronics industry, has successfully supplied Concurrent Technologies Plc (Concurrent), a designer and manufacturer of mission-critical embedded computing solutions, with their second ASSCON vapour phase soldering system, the innovative VP2100-100 inline unit.
Knocking Down the Bone Pile: Solderability Test Methods, Myths, and Realities
11/26/2025 | Nash Bell -- Column: Knocking Down the Bone PileSolderability testing answers a simple question: How readily will a termination form a sound solder joint under defined conditions? It is not component preconditioning. Rather, it evaluates wetting—the speed and extent to which molten solder spreads and adheres to a surface—using controlled methods (e.g., visual “dip-and-look” or wetting-balance measurements). Results reflect the combined effects of termination finish, storage and handling, flux activity, and the solder alloy in use.
Indium Experts to Present on Power Electronics at productronica 2025
11/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly and e-Mobility industries, Indium Corporation® experts will share their technical insight and knowledge on a variety of industry-related topics during Productronica, November 18-21, in Munich, Germany.