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Spotlight on Mexico
Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
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ZESTRON Academy Announces 2020 Cleaning Webinar Schedule
February 24, 2020 | ZESTRONEstimated reading time: Less than a minute
ZESTRON Academy, the global leading provider of cleaning process education to the electronics manufacturing and semiconductor industries, is pleased to announce the 2020 Cleaning Webinar Series schedule. ZESTRON Academy continues to educate production line operators, manufacturing and quality control managers as well as process engineers by providing detailed industry knowledge and troubleshooting techniques.
All webinars are FREE of charge, and will be presented by ZESTRON Academy’s accredited experts, Umut Tosun, M.S.Ch.E., Application Technology Manager, Ravi Parthasarathy, M.S.Ch.E., Senior Application Engineer, and Jigar Patel, M.S.Ch.E., Senior Application Engineer.
Featured topics:
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Should You Clean PCBs? (March 26)
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Cleaning Before Conformal Coating (April 23)
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Cleaning with pH Neutral Chemistry (May 28)
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Jet Printing Solder Paste and Cleaning Challenges (June 18)
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Surface Cleanliness Assessment (July 23)
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Defluxing Advanced Packages (August 27)
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Solder Mask and Low Stand-off Component Cleaning—A Connection? (September 17)
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Multiple Thermal Cycles (October 29)
For more information on ZESTRON Academy or to register for our cleaning webinar series, please visit ZESTRON Academy.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.