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Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
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ZESTRON Academy Announces 2020 Cleaning Webinar Schedule
February 24, 2020 | ZESTRONEstimated reading time: Less than a minute
ZESTRON Academy, the global leading provider of cleaning process education to the electronics manufacturing and semiconductor industries, is pleased to announce the 2020 Cleaning Webinar Series schedule. ZESTRON Academy continues to educate production line operators, manufacturing and quality control managers as well as process engineers by providing detailed industry knowledge and troubleshooting techniques.
All webinars are FREE of charge, and will be presented by ZESTRON Academy’s accredited experts, Umut Tosun, M.S.Ch.E., Application Technology Manager, Ravi Parthasarathy, M.S.Ch.E., Senior Application Engineer, and Jigar Patel, M.S.Ch.E., Senior Application Engineer.
Featured topics:
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Should You Clean PCBs? (March 26)
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Cleaning Before Conformal Coating (April 23)
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Cleaning with pH Neutral Chemistry (May 28)
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Jet Printing Solder Paste and Cleaning Challenges (June 18)
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Surface Cleanliness Assessment (July 23)
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Defluxing Advanced Packages (August 27)
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Solder Mask and Low Stand-off Component Cleaning—A Connection? (September 17)
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Multiple Thermal Cycles (October 29)
For more information on ZESTRON Academy or to register for our cleaning webinar series, please visit ZESTRON Academy.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.