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ZESTRON Academy Announces 2020 Cleaning Webinar Schedule
February 24, 2020 | ZESTRONEstimated reading time: Less than a minute
ZESTRON Academy, the global leading provider of cleaning process education to the electronics manufacturing and semiconductor industries, is pleased to announce the 2020 Cleaning Webinar Series schedule. ZESTRON Academy continues to educate production line operators, manufacturing and quality control managers as well as process engineers by providing detailed industry knowledge and troubleshooting techniques.
All webinars are FREE of charge, and will be presented by ZESTRON Academy’s accredited experts, Umut Tosun, M.S.Ch.E., Application Technology Manager, Ravi Parthasarathy, M.S.Ch.E., Senior Application Engineer, and Jigar Patel, M.S.Ch.E., Senior Application Engineer.
Featured topics:
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Should You Clean PCBs? (March 26)
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Cleaning Before Conformal Coating (April 23)
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Cleaning with pH Neutral Chemistry (May 28)
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Jet Printing Solder Paste and Cleaning Challenges (June 18)
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Surface Cleanliness Assessment (July 23)
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Defluxing Advanced Packages (August 27)
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Solder Mask and Low Stand-off Component Cleaning—A Connection? (September 17)
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Multiple Thermal Cycles (October 29)
For more information on ZESTRON Academy or to register for our cleaning webinar series, please visit ZESTRON Academy.
Suggested Items
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.