Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
It’s Only Common Sense: Selling During an Economic Downturn
Marcy’s Musings: Can You Hear the Voices?
Advanced Semiconductor Manufacturing Strategies in AI Era to Highlight ASMC 2020
February 24, 2020 | SEMIEstimated reading time: 1 minute
Covering topics from yield management to metrology in the era of artificial intelligence (AI), more than 100 industry experts will deliver 35 hours of technical presentations on the latest advanced semiconductor manufacturing strategies and methodologies at SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2020), May 4?7, 2020, in Saratoga Springs, New York. Registration is now open.
Drawing an expected 400 attendees, ASMC 2020 will feature the panel discussion "Exascalers, Hyperscalers: Computing at the Edge—Different Modes, Different Nodes" with experts from industry leaders including Applied Materials, Binghamton University, Corning, IBM Global Think Labs, and Tercero Technologies.
Back for its fifth year, the Women in Semiconductors program—May 4 in conjunction with ASMC 2020—will highlight the importance of workplace diversity as the global semiconductor industry works to grow its talent pipeline. Joanne Kamens of Addgene will keynote the event. Registration is complimentary for ASMC attendees.
ASMC is the premier event for industry professionals to network and share insights into best practices for semiconductor manufacturing. The conference is co-chaired by Fred Bouchard of SpareTech and Armando Anaya of Northrop Grumman.
ASMC 2020 Keynotes
- Thomas Sonderman, President, SkyWater Technology
- Jesus del Alamo, Ph.DProfessor of Electrical Engineering, MIT
- Robert Maire, Semiconductor Advisors
Advanced Equipment Processes and MaterialsASMC 2020 technical sessions include:
- Advanced Metal Structures
- Advanced Process Control
- Contamination-Free Manufacturing
- Defect Inspection
- Factory Optimization
- Novel Metrology Techniques
- Optical Metrology and Machine Learning
- Patterning and 3D Metrology
- Smart Manufacturing
- Yield Enhancement/Yield Methodologies
ASMC also features an interactive poster session (including student presentations) and receptions for presenters and conference attendees to network.
ASMC 2020 is the fourth of eight conferences comprising SEMI’s second annual Technology Leadership Series of the Americas, a series that fosters discussions to uncover opportunities in the $2 trillion global electronics manufacturing and design supply chain.
For more conference details, contact Margaret Kindling at mkindling@semi.org or 1.202.393.5552. The media should contact Scott Stevens (for SEMI Americas communications) at scottstevens512@gmail.com for registration information.
SEMI Golden Anniversary
The year 2020 marks SEMI’s golden anniversary. For half a century, SEMI has brought the industry together to connect, collaborate, innovate, and help transform the world with new technologies.
Join us at SEMICON events around the world as we celebrate 50 years of growth in global electronics manufacturing and kick off the next 50 years by highlighting the latest developments, trends and innovations in smart technologies.
Share on:
Suggested Items
SERMA Microelectronics Expand its Facilities in La Rochelle
04/22/2025 | SERMA MicroelectronicsSERMA Microelectronics, a major player in specialized microelectronics, continues its growth with the acquisition of a building adjacent to its current site in La Rochelle.
UHDI Fundamentals: UHDI Drives Unique IoT Innovation in Farming
04/22/2025 | Anaya Vardya, American Standard CircuitsThe combination of UHDI's high-bandwidth capabilities and IoT's real-time data processing can lead to more efficient, immersive, and smarter IoT systems. This convergence of two revolutionary technologies is enabling quantum advancements in some very “unconventional” applications. The typical discussions around UHDI focus on our standard electronics industry market segments like milaero, medical, consumer electronics, etc. IoT is all about machines talking to other machines, machine learning, and artificial intelligence, but again, typically applied in our PCB and assembly operations.
Navigating Change, Mitigating Risk: We’ve Been Here Before
04/22/2025 | Marcy LaRont, PCB007 MagazineI visited with Tom Edman, president and CEO of TTM Technologies, and chair of the IPC Board of Directors. Tom candidly shares his insights into the implications of changes on the defense sector and the broader electronics manufacturing industry, especially concerning PCB manufacturing. With half of TTM’s business tied to defense, Tom discusses the potential opportunities and challenges arising from government initiatives, tariffs, and supply chain complexities.
Federal Electronics Continues Tradition of Giving Back Through McAuley Ministries’ Lunch on Us Program
04/21/2025 | Federal ElectronicsFederal Electronics, a leader in providing advanced electronic manufacturing services, is proud to give back to the local community through its ongoing support of McAuley Ministries.
Wiring the World Together: IPC and WHMA Unveil Global Wire Harness Competitions and Championship
04/21/2025 | IPCIPC, in collaboration with the Wiring Harness Manufacturer's Association (WHMA), has organized the first-ever World Wire Harness Competitions and Championship.