The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
Koh Young Presenting at Upcoming SMTA Technical Forums
March 2, 2020 | Koh Young AmericaEstimated reading time: 2 minutes
In support of the SMTA and its local chapters, Koh Young will be presenting on March 19, 2020 at the events in Dayton, Ohio and Anaheim, California. Based on its award-winning portfolio of inspection and smart factory solutions, Koh Young selected two different technical presentations encompassing the solder paste inspection (SPI) and automated optical inspection (AOI) processes.
At the SMTA event in Anaheim, Allen Phung, Regional Sales Manager for Koh Young America will present on how True 3D AOIs can improve production quality. Over the years, AOI systems have become an integral solution for the electronics manufacturing industry, but not all machines make the grade. For example, component miniaturization poses significant challenges to that true 3D-based systems can overcome. The SMTA LA/OC has scheduled this event to begin at 6:00PM PST in JT Schmid's Restaurant at 2610 East Katella Avenue in Anaheim, California. Be sure to register at www.laocsmta.org.
The second event will be held by the SMTA Ohio chapter at the National Museum of the United States Air Force in Dayton, Ohio on 19Mar. The full day event will help attendees extract value from SPI, AOI, and other inspection technologies in a roundtable presentation format. Isaiah Smith, Regional Sales Manager for Koh Young America will introduce attendees to True 3D SPI and explain its essential role in manufacturing high quality electronic boards. “With my production background as a Process Engineer at EMS providers in New England and my experience with a leading printer supplier, I am eager to share my unique insight about how SPI can improve manufacturing yields,” said Isaiah. “Many manufacturers simply use SPIs for pass/fail defect review. Few are actually performing data analysis.” After this presentation, attendees will understand that using parametric data from SPI can help them characterize, optimize, and validate the print process. Register today at the at SMTA Ohio Valley chapter website accessed through www.smta.org.
If you cannot attend either event, you can still learn more about Koh Young and its best-in-class portfolio of True 3D smart factory solutions, powered by AI at www.kohyoung.com.
About Koh Young
Koh Young, the leading 3D measurement-based inspection equipment and solutions provider, performs an essential role for quality control and process optimization across a growing set of industries including printed circuit board assembly, machining and assembly process manufacturing, semiconductor manufacturing, and various medical fields. In addition to its corporate headquarters in Seoul, Koh Young has sales and support offices in Germany, Japan, Singapore, Penang, China, Brazil, Argentina, Canada, Mexico, and the United States. These local facilities ensure it maintains a close relationship with its growing customer base and provides them with access to a global network of inspection and measurement experts.
Share on:
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.