Global Citizenship: Cultivating Cross-border Partnerships With Integrity
Nolan’s Notes: Moving Forward With Confidence
The Knowledge Base: Beyond the Badge—Why Membership Matters More Than Ever
IPC Issues Call for Participation for IPC APEX EXPO 2021
March 3, 2020 | IPCEstimated reading time: 1 minute
IPC invites engineers, researchers, academics, technical experts and industry leaders to submit technical conference abstracts and course proposals for IPC APEX EXPO 2021 to be held at the San Diego Convention Center. Professional development courses will be held January 23?28, and the technical conference will take place January 26?28, 2021.
The industry’s premier conference and exhibition for the electronics industry, IPC APEX EXPO provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers and executives from all segments of the industry worldwide. To recognize exceptional achievement, awards will be presented for “Best Paper.”
Topics for Technical Conference Papers and Professional Development Courses:
|
|
|
An approximate 300-word technical conference abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted. The submission should describe significant results from experiments and case studies, emphasize new techniques, discuss trends of interest and contain appropriate technical test results.
In addition, course proposals are solicited from individuals interested in presenting half-day (three-hour) professional development courses on design, manufacturing processes and materials. Technical conference paper abstracts are due June 20, 2020 and course proposals are due June 8, 2020. To submit an abstract or course proposal, visit www.ipcapexexpo.org/education/call-for-participation.
For more information on technical conference or professional development course participation, contact Brook Sandy-Smith, IPC technical education program manager at BrookSandy@ipc.org.
Share on:
Suggested Items
Robotas Technologies Champions Innovation in Through-Hole Assembly with Mascot and VERIFY Systems
06/13/2025 | Robotas Technologies Ltd.While Surface Mount Technology (SMT) dominates today’s electronics manufacturing headlines, Robotas Technologies Ltd. continues to lead the charge in advancing Through-Hole Technology (THT) assembly.
ADCO Circuits Joins Forces with Scanfil
06/13/2025 | ADCO CircuitsADCO Circuits, a trusted provider of high-performance electronic assembly services, has sold a majority interest to Scanfil plc, Europe’s largest EMS company and a global leader in contract manufacturing.
Amtech Introduces Smarter, Cost-Optimized Prototyping Approach for PCB Assemblies
06/13/2025 | AmtechAmtech Electrocircuits, a leading provider of manufacturing solutions, has launched a smarter approach to prototyping that reduces cost and accelerates development for OEMs across industrial, medical, aerospace, and other high-mix, high-complexity sectors.
MES & Industry 4.0 Summit Kicks Off in Porto with Global Manufacturing Leaders
06/12/2025 | Critical ManufacturingMES & Industry 4.0 International Summit, hosted by Critical Manufacturing, officially opened its doors today at the iconic Alfândega Congress Centre in Porto.
L3Harris Providing Additional VAMPIRE Counter-UAS Systems to Department of Defense
06/12/2025 | L3Harris TechnologiesL3Harris Technologies has received a new contract through the U.S. Department of Defense for additional VAMPIRE systems, which neutralize unmanned aerial threats.