Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
MacDermid Alpha to Present Research on High-Reliability Alloys at SMTA Philadelphia Chapter Meeting
March 4, 2020 | MacDermid Alpha Electronics SolutionsEstimated reading time: 2 minutes
MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will present at the SMTA Philadelphia Chapter meeting being held on March 12th, 2020 at Lutron Electronics, Inc. in Coopersburg, Pennsylvania.
Jason Fullerton, Customer Technical Support Engineer at MacDermid Alpha, is one of two featured speakers at this event. Fullerton will present Advances in Lead-free Solder Technologies for High Reliability Applications. This paper will explore lead-free alloy development, enhancements in solder paste performance, and processing differences between these alloys and typical SAC and tin-lead alloys. “Environmental regulations have driven the electronics industry to adopt lead-free solders. However, high reliability applications continue to use legacy tin-lead solder alloys,” said Fullerton. “We’ll discuss how evolving designs, service environments, and reliability requirements have driven development of new types of solder alloys.”
The second speaker will be Greg Smith, Manager of Stencil Technology at BlueRing Stencils. Smith will present Root Cause Stencil Design for SMT Components Thermal Lands. This paper will explore recent studies on stencil design to minimize voiding on quad flat no-lead (QFN) thermal lands and the effect of the window pane design on void area percentage after reflow for surface mount technology (SMT) component thermal pads without introducing float to the component. Areas of focus will be specific window pane gap sizes, total area printed, and the distance of the outer pane edges to the copper thermal land edge will be varied to determine guidelines for thermal pad stencil design.
The Chapter Meeting will begin at 5:15 pm with dinner and networking, followed by the presentations which begin at 6:15 pm. This is the first meeting organized by newly appointed Chapter President, Anna Lifton, Research and Development Manager at MacDermid Alpha. Event sponsors are StenTech and Argo/Zeta with Lutron Electronics hosting the evening’s event.
The event is open to SMTA members and non-members. Those interested can register at the Philadelphia Chapter page on the SMTA website.
You can learn more about MacDermid Alpha’s solutions to optimize component reliability and assembly at MacDermidAlpha.com.
About MacDermid Alpha Electronics Solutions
Through the innovation of specialty chemicals and materials under our Alpha, Kester, Compugraphics, and MacDermid Enthone brands, we provide solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partners clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find out more at MacDermidAlpha.com.
About SMTA
The Surface Mount Technology Association (SMTA) is a non-profit international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations. For more information, visit http://www.smta.org.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/29/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.