-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSoldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Rehm Redesigns ViCON Protecto System Software to Improve Dispensing and Coating Systems
March 6, 2020 | Rehm Thermal SystemsEstimated reading time: 3 minutes
Forward-looking electronics manufacturing is characterised, among other things, by the fact that the individual machines—and therefore the entire manufacturing process—are networked. This not only enables efficient work, but also creates transparency and a seamless traceability of data and process flows. With the ViCON system software, Rehm Thermal Systems has developed a user interface that enables the user to work intuitively. ViCON has now been redesigned for the special requirements of the dispensing and coating systems of the Protecto series (ViCON Protecto).
The specifications of the ViCON Protecto are derived from the fundamental elements of the ViCON, which have already proven effective in the convection soldering systems of the Vision series from Rehm Thermal Systems. The ViCON Protecto can be operated through various gestures via a touch user interface. Another feature of ViCON Protecto is the direct import of ECAD data or image files. An optionally available camera also allows the user to create an overall image of the circuit board using several individual images (‘stitching’).
As the ViCON was being developed for the Protecto series, care was taken to optimise the operating sequence for the user. A wizard guides the system operator through the entire program and the creating of the painting image, while tips in colour show the current status, making operation considerably easier. Among other things, incorrect entries in the painting image creation and unsaved changes are colour-coded. The software also contains a paint database that has already been filled by the application specialists from Rehm Thermal Systems—allowing the user to select the best paint for the selected paint applicator with just a few easy clicks.
For simple and intuitive paint job creation—from individual points to lines and surfaces—different tools can be selected, depending on the applicator. Filled polygons and surfaces can also be created with ViCON Protecto: an integrated 3D function also enables the assembly to be viewed as closely as possible while the painting image is being created. This extended drawing function can also be used to define restricted areas that are to be blocked out during the painting. An arrow at the start of the line to be painted also
indicates the direction in which the paint will be applied. The painting sequence can be changed via the protocol list and tested in live mode with or without paint, which offers efficient painting with minimal empty runs.
Additional features such as a grid or magnifying-glass function and collision detection ensure simple and convenient creation of the painting image. The collision detection prevents components from being damaged during the subsequent painting. For the collision detection, information on the height of the components must be available in the ECAD data record of the components.
In addition to the functions specially tailored to the requirements of Protecto, ViCON Protecto also offers all the features that the basic software for the vision systems already came with. The current system operating status is clearly recognisable for the user, while a colour coding of the status and alarm messages enables the system status to be easily recognised and assigned even over a greater distance, allowing the operator to react quickly and intuitively to the coloured messages.
Access rights, views and favourites can be tailored precisely and individually for each user. In addition, multilingualism is integrated directly into the ViCON: the simple "on the fly" switch to the preferred language simplifies worldwide remote maintenance access to other Rehm systems and operation in an international environment.
About Rehm Thermal Systems
Specialising in thermal system solutions for the electronics and photovoltaic industries, Rehm is a technology and innovation leader in the modern and economical production of electronic assemblies. As a global manufacturer of reflow soldering systems using convection, condensation or vacuum, as well as drying and coating systems, functional test systems, equipment for the metallisation of solar cells and numerous customer-specific special systems, we are represented in all relevant growth markets. As a partner with 30 years of industry experience, we realise innovative manufacturing solutions that set the standards.
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.