Designers Notebook: Layer Stackup Planning for RF Circuit Boards
Connect the Dots: Involving Manufacturers Earlier Prevents Downstream Issues
Global PCB Connections: The Next Wave of HDI PCBs– How Design Engineers Can Stay Ahead
IPC Partners With ANSYS for the High Reliability Forum
March 6, 2020 | IPCEstimated reading time: Less than a minute
PCBs form the backbone of every electronic product. How do we ensure their electrical, thermal and mechanical reliability? Find out at the IPC High Reliability Forum in Cooperation With ANSYS!
May 12–14 | Baltimore, MD
The High Reliability Forum provides a great opportunity to learn about the latest advancements in electronics, participate in industry discussions, and network with this respected community of professionals focused on electronics with high reliability requirements. This event includes keynote, technical presentations, professional development courses, tabletop exhibits and panel discussions.
The full agenda is available now.
Here are just a few of the topics we’ll cover:
- Implementing End-to-End Electronics Reliability Workflow
- Role and Selection Criteria of Surface Finish for Next Generation PCB Technologies
- HDI
- Materials for 5G
- Surface Reliability
We’re also bringing back the popular Microvia Summit with updates from speakers on issues such as:
- A Framework for Failure Analysis
- Performance Based Microvia Reliability Testing — What You Need to Know
- Reliability of Microvia
- How to Detect Weak Microvias and Avoid Costly Assembly Defects and Customer Field Failures
If you manufacture, design or test Class 3 electronics for applications with unique safety, reliability and lifetime requirements, you should not miss the High Reliability Forum.
Share on:
Suggested Items
Indium Experts to Present on Power Electronics at PCIM Europe 2025
04/17/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly and e-Mobility industries, Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout PCIM Europe, May 6-8, in Nuremberg, Germany.
Spirit Electronics Expands U.S. Semiconductor Capacity with Acquisition of SMART Microsystems
04/17/2025 | BUSINESS WIREAs part of its strategic commitment to strengthening domestic semiconductor manufacturing, Spirit Electronics has acquired SMART Microsystems, located at Lorain County Community College (LCCC) in Ohio.
Saki America, Appoints Mario Ramírez Galindo as Project Engineer in Mexico
04/17/2025 | Saki America,Saki America, Inc., an innovator in the field of automated optical and X-ray inspection equipment, is pleased to announce the appointment of Mario Ramírez Galindo as Project Engineer in Mexico. In this role, Mario will support Saki’s customers by providing technical expertise, process optimization, and project management to enhance manufacturing efficiency and inspection accuracy.
Transforming the Future of Mobility: DuPont Unveils Silver Nanowire Products in South Korea
04/17/2025 | DuPontDuPont will showcase its state-of-the-art products that incorporate silver nanowire technologies in Hall D, Booth A31 at Electronics Manufacturing Korea (EMK) and Automotive World Korea (AWK) exhibitions from April 16 to 18.
Real Time with... IPC APEX EXPO 2025: IPC Mexico's Journey–Building Community and Partnerships
04/17/2025 | Real Time with...IPC APEX EXPOLorena Villanueva highlights IPC Mexico's three-year journey focused on community building and partnerships with governments and educational institutions. Key milestones include collaboration agreements with state governments and universities to enhance the electronics industry. IPC Days promotes networking and education, while a partnership with UNAM aims to integrate IPC training into engineering programs. The discussion wraps up with congratulations on IPC Mexico's achievements and the launch of the Mexico pavilion at this year's show.