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In this issue, we discuss some of the challenges, pitfalls and mitigations to consider when designing non-standard board geometries. We share strategies for designing odd-shaped PCBs, including manufacturing trade-offs and considerations required for different segments and perspectives.
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IPC Partners With ANSYS for the High Reliability ForumMarch 6, 2020 | IPC
Estimated reading time: Less than a minute
PCBs form the backbone of every electronic product. How do we ensure their electrical, thermal and mechanical reliability? Find out at the IPC High Reliability Forum in Cooperation With ANSYS!
May 12–14 | Baltimore, MD
The High Reliability Forum provides a great opportunity to learn about the latest advancements in electronics, participate in industry discussions, and network with this respected community of professionals focused on electronics with high reliability requirements. This event includes keynote, technical presentations, professional development courses, tabletop exhibits and panel discussions.
The full agenda is available now.
Here are just a few of the topics we’ll cover:
- Implementing End-to-End Electronics Reliability Workflow
- Role and Selection Criteria of Surface Finish for Next Generation PCB Technologies
- Materials for 5G
- Surface Reliability
We’re also bringing back the popular Microvia Summit with updates from speakers on issues such as:
- A Framework for Failure Analysis
- Performance Based Microvia Reliability Testing — What You Need to Know
- Reliability of Microvia
- How to Detect Weak Microvias and Avoid Costly Assembly Defects and Customer Field Failures
If you manufacture, design or test Class 3 electronics for applications with unique safety, reliability and lifetime requirements, you should not miss the High Reliability Forum.
DuPont today announced that Jon Kemp, President, DuPont Electronics & Industrial, has been named Chair of the Board of Industry Leaders of SEMI, a global industry association serving the electronics design and manufacturing supply chain.
With the seemingly endless ways that electronic products are worming their way into our lives, what was once “nice to own” is increasingly considered indispensable. The capabilities of these products have been driven by relentless improvements at every level of the manufacturing chain, from individual transistors (which are approaching Angstrom levels) to systems the size of buildings supporting Bitcoin mining and increasingly distributed AI products.
HARMAN, an automotive electronics technology company and subsidiary of Samsung Electronics Co., Ltd. focused on delivering consumer experiences at automotive grade, confirms it will continue as an Official partner of Scuderia Ferrari for a second Formula One season. The on-track marketing partnership extends to technology on the road, with Ferrari becoming the first automotive OEM to adopt a number of solutions from HARMAN’s in-cabin monitoring system, HARMAN Ready Care, for its next-generation road cars.
Maggie Benson was in an expansive mood. It had been almost three years since her grandfather asked her to take over Benson Electronics. By using Lean techniques, cost modeling the assembly process, and implementing continuous improvement, the company made significant profitability improvements.
I-Connect007 is excited to announce the latest season of its popular podcast, On the Line With..., where industry experts share the latest insights and perspectives on the most relevant topics in the electronics industry. In this new season, “PCB 3.0: A New Design Methodology,” host Nolan Johnson speaks with Cadence experts about the shift taking place in the methods used for designing circuit boards. In this first episode, Product Management Director Patrick Davis addresses the need for change.