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ACDi’s North Carolina Manufacturing Plant Installs New Koh Young 3D SPI and AOI Equipment
March 9, 2020 | ACDiEstimated reading time: 1 minute
 
                                                                    ACDi, a leading electronics manufacturing services provider, announces the most recent capital investment in printed circuit board inspection technology and equipment at their Nashville, North Carolina factory. Final equipment installation and training was recently completed incorporating 3D imaging technology at its Nashville facility with the addition of Koh Young KY8030-3 3D Solder Paste Inspection and Koh Young Zenith Alpha HS 3D Automated Optical Inspection Systems.
Electronics manufacturing industry standards estimate approximately 70% of surface mount technology (SMT) process-related defects originate from the solder paste printing process. Though most all SMT screen printing systems at a minimum incorporate 2D AQL selective inspection capability, having newly installed 3D solder paste inspection (SPI) verifies not only area (L/W) coverage of paste, but also analyzes third dimension volumetric deposition of solder paste. Adding this capability as an inline standalone machine directly behind the printer reduces the screen printer cycle time while also enabling 100% 3D real time total board paste inspection, stopping the process and prompting immediate operator process engagement and equipment adjustment as necessary. Additionally, the KY 8030 SPI system is Industry 4.0 capable for direct machine-to-machine interface with the factory’s Juki G-Titan automated printing system.
Additionally, once 3D SPI process verification has been assured, populated circuit board post reflow 3D Automated Optical Inspection (AOI) capability now validates not only 2D component placement accuracy related to presence, X/Y alignment, orientation and character recognition, but also enables third dimension imaging to verify Z-height factors including coplanarity, lifted leads, discrete SMD head-in-pillow (HiP), bridging, and overall solder joint integrity (insufficient or excess).
ACDi selected Koh Young, not just because they are the leader in number of 3D SPI and AOI systems installed, but to also offer commonality of equipment manufacturers at both our Frederick MD Corporate and Nashville NC production facilities. Standardizing on equipment supports business continuity factors where transition between locations adds value, and also facilitates collaboration among production and engineering staff at both sites further encouraging achievement of one of ACDi’s Fundamental Pillars of Success, a Team Oriented Workforce!
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BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/29/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.

 
                                     
                                     
                                     
                                     
                                             
                                             
                                             
                                             
                                             
                                             
                                     
                                             
                                             Standard of Excellence: Speed vs. Quality in Customer Service
                                         Standard of Excellence: Speed vs. Quality in Customer Service Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
                                         Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
                                         Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control





 
                     
                 
                    