Smart Automation: When It’s Time to Replace SMT Equipment
Learning With Leo: What Is the Cost of Quality Brought About by Training?
Nolan’s Notes: A Tribute to Iola—and Automation
ACDi’s North Carolina Manufacturing Plant Installs New Koh Young 3D SPI and AOI Equipment
March 9, 2020 | ACDiEstimated reading time: 1 minute
ACDi, a leading electronics manufacturing services provider, announces the most recent capital investment in printed circuit board inspection technology and equipment at their Nashville, North Carolina factory. Final equipment installation and training was recently completed incorporating 3D imaging technology at its Nashville facility with the addition of Koh Young KY8030-3 3D Solder Paste Inspection and Koh Young Zenith Alpha HS 3D Automated Optical Inspection Systems.
Electronics manufacturing industry standards estimate approximately 70% of surface mount technology (SMT) process-related defects originate from the solder paste printing process. Though most all SMT screen printing systems at a minimum incorporate 2D AQL selective inspection capability, having newly installed 3D solder paste inspection (SPI) verifies not only area (L/W) coverage of paste, but also analyzes third dimension volumetric deposition of solder paste. Adding this capability as an inline standalone machine directly behind the printer reduces the screen printer cycle time while also enabling 100% 3D real time total board paste inspection, stopping the process and prompting immediate operator process engagement and equipment adjustment as necessary. Additionally, the KY 8030 SPI system is Industry 4.0 capable for direct machine-to-machine interface with the factory’s Juki G-Titan automated printing system.
Additionally, once 3D SPI process verification has been assured, populated circuit board post reflow 3D Automated Optical Inspection (AOI) capability now validates not only 2D component placement accuracy related to presence, X/Y alignment, orientation and character recognition, but also enables third dimension imaging to verify Z-height factors including coplanarity, lifted leads, discrete SMD head-in-pillow (HiP), bridging, and overall solder joint integrity (insufficient or excess).
ACDi selected Koh Young, not just because they are the leader in number of 3D SPI and AOI systems installed, but to also offer commonality of equipment manufacturers at both our Frederick MD Corporate and Nashville NC production facilities. Standardizing on equipment supports business continuity factors where transition between locations adds value, and also facilitates collaboration among production and engineering staff at both sites further encouraging achievement of one of ACDi’s Fundamental Pillars of Success, a Team Oriented Workforce!
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Indium Expert to Present on Advancements in Bi-free In-containing Lower-Temperature Solder at ICEE 2025
12/11/2025 | Indium CorporationIndium Corporation’s Senior R&D Manager of the Alloy Group, Hongwen Zhang, Ph.D., will present on the company’s award-winning Durafuse® Technology during the IEEE International Conference on Emerging Electronics (ICEE), December 13–16, in Bengaluru, India.
Nordson Rolls Out New Feature for Auto Sector
12/09/2025 | Nolan Johnson, SMT007 MagazineAn ever-widening variety of components and denser board features are creating a gap for new equipment. Just as stencils are moving to multi-thickness panels for complex applications, soldering hardware is evolving to become more precise and integrated into the entire manufacturing line. Jeanine Norlin and Roberta Foster-Smith, representatives of Nordson Electronics Solutions, discuss the current state and implications of selective soldering, including a case study of a customer that made a change. How will selective soldering fit into your future?
Nolan’s Notes: A Tribute to Iola—and Automation
12/02/2025 | Nolan Johnson -- Column: Nolan's NotesIn the 1960s and ’70s, when the west side of the Portland, Oregon, metro area was dominated by Tektronix, my grandmother worked as one of the “assembly ladies.” Known as “Tek,” the company was an economic juggernaut, driving the economy of the cities of Beaverton, Tigard, and Hillsboro. The only employer larger than Tektronix was the state of Oregon itself; virtually every Portlander had some connection to Tek.
Indium Expert to Tackle Reliability Challenges in AI and High-Performance Computing at EPTC 2025
11/27/2025 | Indium CorporationIndium Corporation Research Metallurgist Huaguang Wang, Ph.D., will deliver a presentation at the 27th IEEE Electronics Packaging Technology Conference (EPTC 2025). The conference will be held December 2-5, 2025, in Singapore.
Altus Supports Concurrent Technologies’ Production Expansion with Advanced Inline Vapour Phase System
11/26/2025 | Altus GroupAltus Group, a leading distributor of capital equipment for the electronics industry, has successfully supplied Concurrent Technologies Plc (Concurrent), a designer and manufacturer of mission-critical embedded computing solutions, with their second ASSCON vapour phase soldering system, the innovative VP2100-100 inline unit.