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Horizon Sales Builds Momentum with Gen3 Product Line in North America
March 9, 2020 | Horizon SalesEstimated reading time: 1 minute
 
                                                                    Horizon Sales is pleased to announce that their initial efforts as the exclusive North American distributor for the Gen3 product line have kicked off tremendously. Since the start of their relationship with Gen3 at the beginning of 2020, Horizon has equipped their Brighton, Michigan demo room with several Gen3 products, and accomplished multiple customer visits to see the machines in action. Some Gen3 products that have been extremely popular with their customer base are the Gensonic stencil cleaning system, the AutoSIR and the MUST3 solderability tester.
The Gensonic Stencil Cleaning System is especially good at removing solder paste from very small apertures as small as those used for 0201 components. It can be used either directly on the stencil mounted on the printer or after the stencil has been removed. The Gensonic stencil cleaner uses a 40khz ultrasonic generator that cleans with great efficiency, especially in tough applications such as partially set glues.
AutoSIR is used to measure changes in Surface Insulation Resistance. The AutoSIR2+™ system represents a dramatic improvement over existing SIR test alternatives, and its shielded precision electronics allows state-of-the-art accuracy resistance measurements to be made up to 1014 ?.
The MUST3 solderability tester offers the capability to measure down to 0.001mN. It is THE most accurate and comprehensively equipped test system of its type in the world. It has automatic component alignment and testing, immediate pass/fail information on completion of each test, step and repeat function for multi-leaded devices, testing ability down to 0201 devices and more.
In business for more than 25 years, Horizon provides state-of-the-art equipment and supplies to its customers, helping them to achieve best-in-class status in their respective markets. Horizon Sales represents the mid-western states of Michigan, Ohio, Indiana, Kentucky, Western Pennsylvania, Illinois, Eastern Iowa, Wisconsin and Florida. For more information, visit www.horizonsales.com.
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Brent Fischthal - Koh YoungSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/29/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.

 
                                     
                                     
                                     
                                     
                                             
                                             
                                             
                                             
                                             
                                             
                                     
                                             
                                             Standard of Excellence: Speed vs. Quality in Customer Service
                                         Standard of Excellence: Speed vs. Quality in Customer Service Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
                                         Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
                                         Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control





 
                     
                 
                    