Global Citizenship: What I’ve Learned About the American PCB Business
Global Sourcing Spotlight: The Best Products to Buy Offshore Through Global Sourcing
Nolan's Notes: The Rise (and Risk) of Data
CyberOptics Launches 3D MX3000 Final Vision Inspection System for Memory Modules
March 9, 2020 | CyberOptics CorporationEstimated reading time: Less than a minute
CyberOptics® Corporation, a leading global developer and manufacturer of high-precision 3D sensing technology solutions, launches the Multi-Reflection Suppression™ (MRS™)-enabled 3D MX3000 Final Vision Inspection (FVI) system for memory modules. The launch extends the memory module inspection system portfolio from 2D to 3D.
With two high-resolution MRS sensors, the 3D MX3000™ memory module inspection system enables highly accurate, dual-sided final vision inspection and doubles productivity.
Proprietary MRS technology meticulously identifies and rejects multiple reflections caused by shiny and reflective surfaces. Effective suppression of multiple reflections is critical for highly accurate measurements.
“Our MRS sensor technology is widely used in SMT, semiconductor and other challenging applications for inspection and metrology,” said Dr. Subodh Kulkarni, President and CEO, CyberOptics, “We have now integrated the 3D technology into our memory module inspection systems to deliver an unparalleled combination of high resolution, high accuracy and high speed. Ultimately, we’re enabling yield and productivity improvements for our customers.”
The fully automation-ready system provides in-line defect review stations and auto sorts false calls into good trays after review. In-line multiple module grippers minimize handing tact time and autoconversion supports various memory module form factors.
Share on:
Suggested Items
Designing for Cost to Manufacture
11/21/2024 | Marcy LaRont, I-Connect007ICAPE's Richard Koensgen, a seasoned field application engineer with a rich background in PCB technology, shares his journey of working with customers and manufacturers through the intricacies of circuit board development and emphasizes the importance of early-stage collaboration with PCB designers. With a focus on tackling the most challenging aspects of PCB design and manufacturing, he discusses everything from layout considerations to the thermal challenges of today's technology when it comes to designing for cost.
OSI Systems Receives $11M Order for Electronic Assemblies
11/21/2024 | BUSINESS WIREOSI Systems, Inc announced that its Optoelectronics and Manufacturing division has received an order for approximately $11 million to provide critical electronic sub-assemblies for a leading-edge healthcare original equipment manufacturer (OEM), known for innovative and specialized medical solutions.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.
NTT, Olympus Joint Demonstration Shows IOWN APN's Low-latency Capability
11/21/2024 | JCN NewswireNTT Corporation and Olympus Corporation announced that, following the start of their joint experiment in March of the world’s first cloud endoscope system which processes endoscopic videos on the cloud, they jointly established a cloud endoscopy system utilizing the IOWN APN technology.
Hon Hai Joins OpenUSD Alliance to Promote Standardized and Open Source Universal Scenario Description (USD) Technology
11/21/2024 | Hon Hai Technology GroupHon Hai Technology Group , the world’s largest technology manufacturing and service provider, announced that it has joined the Alliance for OpenUSD (AOUSD ) to support the construction of a 3D ecosystem and promote Cooperation among various industries around the world promotes the standardization of Universal Scene Description (USD ).