-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Spotlight on North America
A North America spotlight exploring tariffs, reshoring, AI demand, and supply chain challenges. Plus, insights on cybersecurity, workforce development, and the evolving role of U.S. electronics manufacturing.
Wire Harness Solutions
Explore what’s shaping wire harness manufacturing, and how new solutions are helping companies streamline operations and better support EMS providers. Take a closer look at what’s driving the shift.
Spotlight on Europe
As Europe’s defense priorities grow and supply chains are reassessed, industry and policymakers are pushing to rebuild regional capability. This issue explores how Europe is reshaping its electronics ecosystem for a more resilient future.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Yamaha Motor Europe to Debut New YRM20 Mounter at SMTconnect 2020
March 10, 2020 | Yamaha Motor EuropeEstimated reading time: 2 minutes
Yamaha Motor Europe SMT Section will highlight the next generation machine platform with the first new machine YRM20 surface mounter for data-intensive intelligent manufacturing at SMTconnect 2020 in Nuremberg, May 5-7. The Yamaha booth, 319 hall 4, will also feature the integrated material handling with the YST15 intelligent component storage tower, software tools to boost productivity, and inline modular surface-mount equipment of the Yamaha Total Line Solution.
Making its European debut, the YRM20 introduces Yamaha’s next-generation platform optimised for high-speed, high-volume communication and accelerated data sharing. In addition, the new HM inline head and RM rotary multipurpose head that interfaces efficiently with the latest high-speed feeder, increase speed and versatility. The YRM20 also introduces a new high-precision board mount, new conveyor for faster transport and board replacement, overdrive motion for increased productivity, and advanced, intuitive GUI with focused controls and easier component setup.
Also ready to power smart factories to increased productivity, the YST15 intelligent component storage tower can store up to 1500 reels, load and unload up to 27 reels in one batch, and connect with surface-mount lines to coordinate replenishment automatically.
The next generation software platform will feature in a dedicated display area to demonstrate the latest tools to accelerate equipment programming and setup, simplify real-time control, assist troubleshooting and traceability, and automate data analysis to inform manufacturing and business decision making.
From the Yamaha Total Line Solution, the booth will feature the YSP10 fast-cycle printer with automatic stencil replacement, YSM20R high-speed modular mounter featured for high axis speeds and non-stop operation, YSi-SP 3D solder-paste inspection system, and YSi-V hybrid 2D/3D/4-direction AOI system.
Yamaha technical experts and sales engineers will be available at the booth throughout the event to explain how the Company’s innovative equipment solutions and software tools support smart manufacturing and increase productivity and quality. Visit booth 319, hall 4 to find out more.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
BGA Technology Expands Inspection Capabilities with Creative Electron TruView X-ray System
05/08/2026 | BGA TechnologyBGA Technology, a leading provider of advanced electronics testing and inspection services, has enhanced its inspection capabilities with the addition of a Creative Electron TruView™ Simplex X-ray system at its Holbrook, New York facility.
AQUANOX A4727 and A4625 Lead KYZEN Offerings at SMTA Oregon Expo and Tech Forum
05/06/2026 | KYZENKYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Oregon Expo and Tech Forum scheduled to take place Thursday, May 19 at the Wingspan Event and Conference Center in Hillsboro, Oregon.
Connect the Dots: Designing for the Future of Manufacturing Reality—Surface Finish
05/07/2026 | Matt Stevenson -- Column: Connect the DotsWhen designing the complex boards that many electronic devices require to operate, designers should consider manufacturability at every step. This is my last article focused on designing for the always-evolving manufacturing reality. Choosing the right surface finish has always been important. If you are creating intricate designs with a wide variety of components, like for an ultra-high density interconnect (UHDI) board, surface finish is a critical last step.
Indium to Showcase High-Performance AI Application Solutions at SEMICON SEA 2026
05/01/2026 | Indium CorporationAs a leading provider of advanced materials solutions for today’s demanding AI applications, Indium Corporation® will feature its high-reliability product portfolio at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.