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JAVAD EMS Installs Robotic Soldering to Continued Push to Automate Manufacturing
March 11, 2020 | JAVAD EMSEstimated reading time: 1 minute
 
                                                                    JAVAD EMS (JEMS), a leading global EMS company that provides low to medium volume, high-mix applications, announces that it has installed a Hakko HU-200 Robotic Soldering System at its facility in Silicon Valley. An absolute encoder enables the machine to monitor the location of the soldering iron at all times, ensuring JEMS a high level of repeatability and automation.
The HU-200 is a 4-axis system with a large working envelope of 200mm x 300mm. The system offers a top speed of 800mm/s and boasts a repeatability of 0.01mm. The HU-200 utilizes the power of the Hakko FU-601 Robotic Integration Soldering Module but integrates the communication of the Hakko FU500 Feeder Controller directly into the robot.
Gary Walker, Vice President of JEMS stated: “We have continued to look into all ways to automate our processes to drive down costs and increase efficiency. One thought was to look at ways to automate hand soldering to help mitigate the pressure of the availability of skilled hand soldering personnel here in the Bay Area. The Hakko soldering robot is a solution to that issue. The key for us was to find something that is easy to program and operator friendly to use while at same time not compromising quality in any way. We have been able to more than meet those objectives and are currently using the system on numerous PCBAs for a variety of customers and applications with the expectation that more of these systems will be put into production in the near future.”
JEMS’ surface-mount-technology (SMT) lines are complete with inline three-dimensional (3D) solder paste inspection and AOI complimented by fully automated 3D X-ray for solder joint inspection. The company has more than 40,000 ft.2 of manufacturing space that it continually updates to the highest standards of electronic manufacturing services, communication, client support, employee comfort, and training.
JEMS’ manufacturing lines are highly flexible, allowing for diverse and complex products using the latest in component packaging technologies to be assembled and with quick changeover between products, enabling high-mix, low to medium volume production.
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10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
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Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.

 
                                     
                                     
                                     
                                     
                                             
                                             
                                             
                                             
                                             
                                             
                                     
                                             
                                             Standard of Excellence: Speed vs. Quality in Customer Service
                                         Standard of Excellence: Speed vs. Quality in Customer Service Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
                                         Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
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