-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Semiconductors in Charge: The Changing Face of PCB Manufacturing
March 11, 2020 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
The I-Connect007 editorial team recently spoke with Chuck Bauer and Dana Korf in a technical discussion that spanned a number of topics around shrinking components, such as redistribution layers (RDLs), active embeddeds, and why even the most revolutionary technologies must show ROI to be successful.
Nolan Johnson: Thanks for joining us. There is a miniaturization and design constraint shift going on as a result of increased densities and shrinking board sizes that also seems to be pushing on the component supply chain. It’s not entirely clear to me whether components are driving board design shrinks or whether shrinking board size is driving component miniaturization. Let’s start with you, Chuck.
Chuck Bauer: It is kind of difficult; I haven’t thought about it a lot from that perspective. In general, we all know that the primary custom component of the product is the PCB. Most of the other components are pretty much standardized. But even though the PCB may not be a major piece of the bottom line cost, it is generally the only fully custom component in the product other than some of the external design functions. Packaging capability is driving toward miniaturization, primarily for two reasons. There’s a moderate impact on the cost by miniaturizing the package, but there’s a more significant impact on the cost by miniaturizing the board. The components drive the miniaturization from a technology standpoint, and the boards drive miniaturization from a cost standpoint.
Happy Holden: Yes, but what’s the drive toward wafer-level packaging? Is it to get away from having to buy a separate component that gets assembled flip-chip-wise or something like that? From what we’ve been following from the ECTC conference, the wafer-level packaging sessions keep growing and growing.
Bauer: The trends in wafer-level packaging are driven almost entirely by cost. The technology for doing it is like anything else; if you can minimize the cost, you’re going to have an opportunity to either capture market share by reducing pricing or increasing margins. Cost is always the driver. Holden: There seems to be a major push into the electronic panel level, wafer column plating, and other finishes for a level of assembly automation that includes embedded actives in the semiconductor package.
To read this entire interview, which appeared in the February 2020 issue of SMT007 Magazine, click here.
Suggested Items
Würth Elektronik in United States Embarks on New Milestone with State-of-the-Art Headquarters
05/17/2024 | Wurth ElektronikWürth Elektronik in the United States, a leading manufacturer of electronic and electromechanical components as well as custom magnetics, has announced the commencement of construction on a new 70,000-square-foot headquarters. This new facility underscores the company’s commitment to innovation and grow in the electronics industry.
IPC APEX EXPO: Some Thoughts About Growth
05/16/2024 | Dan Feinberg, I-Connect007After two and a half days of wandering the aisles at IPC APEX EXPO 2024, for the first time, I almost felt like I was exploring CES. There were so many booths and exhibits that I could describe, but I’d like to focus on the growth and huge value of this event, which has expanded well beyond just the growing and impressive exhibit show floor.
Airbus Achieves Eurodrone’s Preliminary Design Review
05/16/2024 | AirbusThe Eurodrone programme has successfully performed the Preliminary Design Review (PDR). Led by Airbus Defence and Space as prime contractor, this major programme milestone has been completed with OCCAR and representatives of the four customer nations (France, Germany, Italy and Spain) in the presence of the three Major Sub-Contractors (MSC), Airbus Defence and Space Spain, Dassault Aviation and Leonardo.
A Review of the 2024 Del Mar Electronics and Manufacturing Show
05/16/2024 | Barry Matties, I-Connect007The Del Mar Electronics and Manufacturing Show (DMEMS) in Del Mar, California, recently took place at an unlikely venue: the Del Mar Fairgrounds. Doug Bodenstab, founder and show organizer, says the show covers everything in electronics manufacturing: design tools, components, base materials, training, testing, board fabrication, AI, data analytics, and more. While you can find about anything online these days, Bodenstab adds that there is no substitute for meeting people in person.
TactoTek Licenses IMSE Technology to Polestar for Sustainable Electronics Design Innovation
05/15/2024 | TactoTekPolestar, the Swedish electric performance car brand, and Finnish smart surface pioneer TactoTek, have entered a collaboration to explore integration of Injection Molded Structural Electronics (IMSE) technology into Polestar’s vehicle programs.