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Take Advantage of e-Education: Watch Free Webinar Series ‘Coatings Uncoated!’
March 11, 2020 | I-Connect007 Editorial TeamEstimated reading time: 1 minute

The ninth episode of the popular webinar series “Coatings Uncoated!” is now available to view. Author of The Printed Circuit Assembler’s Guide to...Conformal Coatings for Harsh Environments and topic expert Phil Kinner from Electrolube shares highly focused educational information on conformal coating and encapsulation. If you are in the assembly business, an EMS company, or responsible for specifying conformal coating and/or encapsulation, then this free series is for you.
In this new segment, viewers will learn about an automotive-based application (engine management system). Over a period of two years, the number of field failures escalated beyond all accepted levels, and a new solution was required. Phil discusses the finer details of this interesting case study.
Watch the latest segment, “Don’t Choose a Coating That Cracks Under Pressure,” in just six minutes!
In this engaging, 12-part webinar series, Kinner examines conformal coating chemistries in further detail, including their properties, applications, issues to be mindful of, and the processes you should follow to achieve a successful coating outcome. The entire “Coatings Uncoated!” webinar series can be viewed in an hour and covers a comprehensive range of hot topics and application-relevant case-study overviews, as well as back-to-basic subject matter and issues, such as condensation and contamination. Most of the 12 segments can be viewed in five minutes or less.
Got six minutes? Visit iconnect007.com/webinar/cu.
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Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
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Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
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Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology, Inc. That Achieves Yields Greater Than 99% for Underfilling During Semiconductor Manufacturing
06/11/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. edwd