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PDR to Exhibit with PAC Global at the SMTA Dallas & Houston Expos
March 12, 2020 | PDREstimated reading time: 1 minute
PDR, a leading manufacturer of BGA rework systems, test, and inspection equipment since 1985, will exhibit with its representative PAC Global at the SMTA Dallas and Houston Expo & Tech Forums. The Dallas Expo is scheduled to take place Tuesday, March 24, 2020 at the Plano Event Center in Plano, TX, and the Houston Expo will be held Thursday, March 26, 2020 at The Stafford Centre in Stafford, TX. The company will discuss the award-winning IR-E3G Gold Rework System and GenX-90P X-ray System.
The versatile PDR IR- E3G is ideal for a very wide range of SMD/BGA/uBGA/CSP/LED applications on small-large sized PCBs. The IR-E3G adds superior thermal control and twin cameras for precision alignment and process observation. Non-contact pyrometers focus on the component and the PCB, for thermal feedback to auto-profiling ThermoActive V7 software. With camera input, the software also permits still and video capture.
The GenX-90P offers truly remarkable image clarity with proprietary HD camera and software. The compact system accommodates PCB sizes up to 21” (533mm) X 17.5” (445mm). Customizable Flat Panel Detectors or Image Intensifier options are available to meet varying application requirements. Additionally, the high performance X-ray system offers programmable 4-axis (X,Y, Z 1/Z2) fully motorized motion control. The GenX-90P features a 90kV, 8 Watt, 4um X-ray tube, 0.18mA with magnification up to 1100X.
PDR Rework Systems remains at the forefront of rework technology by providing air nozzle free systems with advanced in-process control features and visible light that takes the guesswork out of rework. PDR X-ray Solutions was founded in 2012, distributing and supporting X-ray solutions for industry under the PDR brand as well as other well-known X-ray brands.
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Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.