Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

PGZ, Safran to Pursue Further Cooperation

04/01/2025 | Safran
Polska Grupa Zbrojeniowa S.A. and Safran, a French high-technology group and major player in aerospace and defense, have signed a Memorandum of Understanding to jointly pursue further business opportunities as part of European defense industry cooperation efforts.

European Chips Skills Academy Launches ECS Summer School 2025 to Inspire Future Electronics Talent

04/01/2025 | JCN Newswire
The European Chips Skills Academy (ECSA), an EU-funded project coordinated by SEMI Europe, in collaboration with industry partners AENEAS, EPoSS, and INSIDE, has announced the launch of the ECS Summer School 2025.

Meyer Burger, Memodo Sign Supply Agreement for Italy

03/28/2025 | Meyer Burger
Meyer Burger Technology AG and photovoltaic distributor Memodo have signed a supply agreement. The high-performance modules “Made in Germany” were manufactured at the Freiberg plant in Germany and are intended for the Italian market.

New COO to Drive Operational Excellence at ESCATEC

03/24/2025 | ESCATEC
Growth-orientated electronics manufacturing services (EMS) provider, ESCATEC, intends to maximise operational efficiencies with the appointment of industry expert Alessandro Marinai as its new Chief Operating Officer (COO).

SEMI, ESIA Rally Political Support for a European Semiconductor Strategy

03/20/2025 | SEMI
Seeking to explore semiconductor policy measures that can strengthen the industrial policy in the European Union, SEMI and the European Semiconductor Industry Association (ESIA) have successfully held a high-level roundtable event in the European Parliament under the auspices of Members of the European Parliament (MEPs) Bart Groothuis (Renew Europe), Oliver Schenk (European People’s Party) and Dan Nica (Socialists and Democrats Party).
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in