Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
YESTECH’s New Large Area LX-1000 AOI System Enhances Inspection Capabilities
March 16, 2020 | Nordson YESTECHEstimated reading time: 1 minute
YESTECH, part of Nordson ELECTRONICS SOLUTIONS and a leading supplier of automated optical and conformal coat inspection systems for the electronics industry, announced today the introduction of their all new LX-1000 large area Automated Optical Inspection system.
YESTECH’s LX-1000 in-line, large area automated optical inspection system offers high-speed PCB assembly inspection with exceptional defect coverage, inspecting solder joints and verifying correct part assembly, enabling users to improve quality and increase throughput. Its advanced multi-purpose, double-sided inspection system provides exceptional defect coverage, with dual sided top-down and bottom up viewing sensors, enabling users to improve quality and enhance yields.
Advanced 2D and 3D sensors and newly available image processing technology integrates several techniques, including fringe projection, color inspection, normalized correlation and rule-based algorithms, to provide complete inspection metrology with an unmatched low false failure rate. Programming the LX-1000 is fast and intuitive. Operators typically take less than 60 minutes to create a complete inspection program including solder inspection. The LX-1000 utilizes a standard package library to simplify training and ensure program portability across manufacturing lines.
The LX-1000 is highly effective for selective solder, post wave and connector inspections. Off-line programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield enhancement solution.
- Single or dual sided imaging with full travel imaging sensors
- 630mm x 630mm large inspection area
- Optional 3D and/or 2D automated inspection
- Up to 100 mm clearance
- Heavy duty conveyor options for samples to 15kg
- High defect coverage / low false failure rate
- MES / Industry 4.0 compatible
“The LX-1000 AOI is a valuable asset to any organization’s quality control procedure,” said Don Miller, YESTECH Vice President. “The large area, dual-sided inspection offers a tremendous amount of flexibility to our customers, allowing them to inspect a broader range of boards. And as with all our systems, it offers the accuracy and reliability our customers demand.”
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/29/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.