Global Citizenship: Cultivating Cross-border Partnerships With Integrity
Nolan’s Notes: Moving Forward With Confidence
The Knowledge Base: Beyond the Badge—Why Membership Matters More Than Ever
YESTECH’s New Large Area LX-1000 AOI System Enhances Inspection Capabilities
March 16, 2020 | Nordson YESTECHEstimated reading time: 1 minute
YESTECH, part of Nordson ELECTRONICS SOLUTIONS and a leading supplier of automated optical and conformal coat inspection systems for the electronics industry, announced today the introduction of their all new LX-1000 large area Automated Optical Inspection system.
YESTECH’s LX-1000 in-line, large area automated optical inspection system offers high-speed PCB assembly inspection with exceptional defect coverage, inspecting solder joints and verifying correct part assembly, enabling users to improve quality and increase throughput. Its advanced multi-purpose, double-sided inspection system provides exceptional defect coverage, with dual sided top-down and bottom up viewing sensors, enabling users to improve quality and enhance yields.
Advanced 2D and 3D sensors and newly available image processing technology integrates several techniques, including fringe projection, color inspection, normalized correlation and rule-based algorithms, to provide complete inspection metrology with an unmatched low false failure rate. Programming the LX-1000 is fast and intuitive. Operators typically take less than 60 minutes to create a complete inspection program including solder inspection. The LX-1000 utilizes a standard package library to simplify training and ensure program portability across manufacturing lines.
The LX-1000 is highly effective for selective solder, post wave and connector inspections. Off-line programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield enhancement solution.
- Single or dual sided imaging with full travel imaging sensors
- 630mm x 630mm large inspection area
- Optional 3D and/or 2D automated inspection
- Up to 100 mm clearance
- Heavy duty conveyor options for samples to 15kg
- High defect coverage / low false failure rate
- MES / Industry 4.0 compatible
“The LX-1000 AOI is a valuable asset to any organization’s quality control procedure,” said Don Miller, YESTECH Vice President. “The large area, dual-sided inspection offers a tremendous amount of flexibility to our customers, allowing them to inspect a broader range of boards. And as with all our systems, it offers the accuracy and reliability our customers demand.”
Share on:
Suggested Items
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
Breaking Silos with Intelligence: Connectivity of Component-level Data Across the SMT Line
06/09/2025 | Dr. Eyal Weiss, CybordAs the complexity and demands of electronics manufacturing continue to rise, the smart factory is no longer a distant vision; it has become a necessity. While machine connectivity and line-level data integration have gained traction in recent years, one of the most overlooked opportunities lies in the component itself. Specifically, in the data captured just milliseconds before a component is placed onto the PCB, which often goes unexamined and is permanently lost once reflow begins.
BEST Inc. Introduces StikNPeel Rework Stencil for Fast, Simple and Reliable Solder Paste Printing
06/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and products is pleased to introduce StikNPeel™ rework stencils. This innovative product is designed for printing solder paste for placement of gull wing devices such as quad flat packs (QFPs) or bottom terminated components.
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.