Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMTA International Technical Committee Announces Best Presentation and Paper Awards from the 2019 Conference
March 18, 2020 | SMTAEstimated reading time: 1 minute
The SMTA is pleased to announce the Best Papers from SMTA International 2019. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. For these exceptional achievements, a cash award and plaque are given to primary authors of all winning papers.
Chris Gourlay, Imperial College London won the Best of Proceedings category for the paper "Phase Formation and Solid Solubility in High Reliability Pb-Free Solders Containing Bi, Sb, In."
Richard Coyle, Ph.D., Nokia Bell Labs, came in second for the paper “Vacuum Reflow Processing of Ball Grid Array Packages to Reduce Solder Joint Voiding and Improve Attachment Reliability.”
Yoshinori Ejiri, Hitachi Chemical Co., Ltd. took third place for the paper “Wire Bonding Reliability of Electroless Ni/Pd/Au Plating Influence of Electroless Pd Deposition Reaction.”
The winner from SMTA International 2019 for the Rich Freiberger Best of Conference Award, as selected by the conference attendees, is Michael Konrad, Aqueous Technologies, for the presentation entitled "IPC's New Cleanliness Testing Standard is Now Active. What's New? What Stays the Same?" The award is based on the conference attendees' rating of each speaker at the technical session.
Best Student Presentation was awarded to Faramarz Hadian, Binghamton University, for the paper “Study Electromigration in SnBiAg / SAC(305) Mixed Solder Alloy.”
The authors will formally be presented their awards during SMTA International on September 27?October 1, 2020 in Rosemont, Illinois. For information on participating in the 2020 SMTA International Conference, visit the Call for Papers page at https://smta.org/smtai/call_for_papers.cfm. Abstracts can be uploaded directly on-line and are still being accepted.
The papers are available in the conference proceedings available in the SMTA Bookstore at https://www.smta.org/store/book_store.cfm. The individual articles are available for SMTA members to download from the knowledge base.
For more information contact Tanya Martin: tanya@smta.org or +1-952-920-7682 or visit https://www.smta.org.
SMTA—A Global Association Working at a Local Level
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/29/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.