-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
Article Highlights
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
SMTA International Technical Committee Announces Best Presentation and Paper Awards from the 2019 Conference
March 18, 2020 | SMTAEstimated reading time: 1 minute
The SMTA is pleased to announce the Best Papers from SMTA International 2019. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. For these exceptional achievements, a cash award and plaque are given to primary authors of all winning papers.
Chris Gourlay, Imperial College London won the Best of Proceedings category for the paper "Phase Formation and Solid Solubility in High Reliability Pb-Free Solders Containing Bi, Sb, In."
Richard Coyle, Ph.D., Nokia Bell Labs, came in second for the paper “Vacuum Reflow Processing of Ball Grid Array Packages to Reduce Solder Joint Voiding and Improve Attachment Reliability.”
Yoshinori Ejiri, Hitachi Chemical Co., Ltd. took third place for the paper “Wire Bonding Reliability of Electroless Ni/Pd/Au Plating Influence of Electroless Pd Deposition Reaction.”
The winner from SMTA International 2019 for the Rich Freiberger Best of Conference Award, as selected by the conference attendees, is Michael Konrad, Aqueous Technologies, for the presentation entitled "IPC's New Cleanliness Testing Standard is Now Active. What's New? What Stays the Same?" The award is based on the conference attendees' rating of each speaker at the technical session.
Best Student Presentation was awarded to Faramarz Hadian, Binghamton University, for the paper “Study Electromigration in SnBiAg / SAC(305) Mixed Solder Alloy.”
The authors will formally be presented their awards during SMTA International on September 27?October 1, 2020 in Rosemont, Illinois. For information on participating in the 2020 SMTA International Conference, visit the Call for Papers page at https://smta.org/smtai/call_for_papers.cfm. Abstracts can be uploaded directly on-line and are still being accepted.
The papers are available in the conference proceedings available in the SMTA Bookstore at https://www.smta.org/store/book_store.cfm. The individual articles are available for SMTA members to download from the knowledge base.
For more information contact Tanya Martin: tanya@smta.org or +1-952-920-7682 or visit https://www.smta.org.
SMTA—A Global Association Working at a Local Level
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.