-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Spotlight on North America
A North America spotlight exploring tariffs, reshoring, AI demand, and supply chain challenges. Plus, insights on cybersecurity, workforce development, and the evolving role of U.S. electronics manufacturing.
Wire Harness Solutions
Explore what’s shaping wire harness manufacturing, and how new solutions are helping companies streamline operations and better support EMS providers. Take a closer look at what’s driving the shift.
Spotlight on Europe
As Europe’s defense priorities grow and supply chains are reassessed, industry and policymakers are pushing to rebuild regional capability. This issue explores how Europe is reshaping its electronics ecosystem for a more resilient future.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
SMTA International Technical Committee Announces Best Presentation and Paper Awards from the 2019 Conference
March 18, 2020 | SMTAEstimated reading time: 2 minutes
The SMTA is pleased to announce the Best Papers from SMTA International 2019. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. For these exceptional achievements, a cash award and plaque are given to primary authors of all winning papers.
Chris Gourlay, Imperial College London won the Best of Proceedings category for the paper "Phase Formation and Solid Solubility in High Reliability Pb-Free Solders Containing Bi, Sb, In."
Richard Coyle, Ph.D., Nokia Bell Labs, came in second for the paper “Vacuum Reflow Processing of Ball Grid Array Packages to Reduce Solder Joint Voiding and Improve Attachment Reliability.”
Yoshinori Ejiri, Hitachi Chemical Co., Ltd. took third place for the paper “Wire Bonding Reliability of Electroless Ni/Pd/Au Plating Influence of Electroless Pd Deposition Reaction.”
The winner from SMTA International 2019 for the Rich Freiberger Best of Conference Award, as selected by the conference attendees, is Michael Konrad, Aqueous Technologies, for the presentation entitled "IPC's New Cleanliness Testing Standard is Now Active. What's New? What Stays the Same?" The award is based on the conference attendees' rating of each speaker at the technical session.
Best Student Presentation was awarded to Faramarz Hadian, Binghamton University, for the paper “Study Electromigration in SnBiAg / SAC(305) Mixed Solder Alloy.”
The authors will formally be presented their awards during SMTA International on September 27?October 1, 2020 in Rosemont, Illinois. For information on participating in the 2020 SMTA International Conference, visit the Call for Papers page at https://smta.org/smtai/call_for_papers.cfm. Abstracts can be uploaded directly on-line and are still being accepted.
The papers are available in the conference proceedings available in the SMTA Bookstore at https://www.smta.org/store/book_store.cfm. The individual articles are available for SMTA members to download from the knowledge base.
For more information contact Tanya Martin: tanya@smta.org or +1-952-920-7682 or visit https://www.smta.org.
SMTA—A Global Association Working at a Local Level
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
BGA Technology Expands Inspection Capabilities with Creative Electron TruView X-ray System
05/08/2026 | BGA TechnologyBGA Technology, a leading provider of advanced electronics testing and inspection services, has enhanced its inspection capabilities with the addition of a Creative Electron TruView™ Simplex X-ray system at its Holbrook, New York facility.
AQUANOX A4727 and A4625 Lead KYZEN Offerings at SMTA Oregon Expo and Tech Forum
05/06/2026 | KYZENKYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Oregon Expo and Tech Forum scheduled to take place Thursday, May 19 at the Wingspan Event and Conference Center in Hillsboro, Oregon.
Connect the Dots: Designing for the Future of Manufacturing Reality—Surface Finish
05/07/2026 | Matt Stevenson -- Column: Connect the DotsWhen designing the complex boards that many electronic devices require to operate, designers should consider manufacturability at every step. This is my last article focused on designing for the always-evolving manufacturing reality. Choosing the right surface finish has always been important. If you are creating intricate designs with a wide variety of components, like for an ultra-high density interconnect (UHDI) board, surface finish is a critical last step.
Indium to Showcase High-Performance AI Application Solutions at SEMICON SEA 2026
05/01/2026 | Indium CorporationAs a leading provider of advanced materials solutions for today’s demanding AI applications, Indium Corporation® will feature its high-reliability product portfolio at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.