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MES Software Tools Need Thoughtful Integration

10/21/2025 | Nolan Johnson, SMT007 Magazine
The Global Electronics Association recently published a survey report on the state of EMS production software. This project, led by Thiago Guimaraes, director of industry intelligence,  connects the dots across the global electronics value chain to uncover practical insights that individual companies might not have seen on their own. In this interview, Thiago discusses the whys and hows of this report.

Light-curable Solutions for Reliable Electronics in Space Applications

10/15/2025 | Virginia Hogan, Dymax
Designing electronics for space environments, particularly those in low Earth orbit (LEO), requires careful consideration of materials that can withstand extreme conditions while supporting long-term reliability. Engineers designing satellite systems, aerospace instrumentation, and high-altitude platforms face a familiar set of challenges: contamination control, mechanical stress, thermal cycling, and manufacturability.

Analog Devices Launches ADI Power Studio™ and New Web-Based Tools

10/14/2025 | Analog Devices, Inc.
Analog Devices, Inc., a global semiconductor leader, announced the launch of ADI Power Studio, a comprehensive family of products that offers advanced modeling, component recommendations and efficiency analysis with simulation. In addition, ADI is introducing early versions of two new web-based tools with a modernized user experience under the Power Studio umbrella:

Elementary, Mr. Watson: High Power: When Physics Becomes Real

10/15/2025 | John Watson -- Column: Elementary, Mr. Watson
Have you ever noticed how high-speed design and signal integrity classes are always packed to standing room only, but just down the hall, the session on power electronics has plenty of empty chairs? It's not just a coincidence; it's a trend I've observed over the years as both an attendee and instructor.

Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics

10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics Solutions
As power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).
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