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Indium Corporation Names Silver Quill Award Winner
March 18, 2020 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation has acknowledged several of its employees for their industry contributions with its annual Silver Quill Award.
Indium Corporation’s Silver Quill Award program recognizes individuals who have authored original technical content in the form of conference papers, articles, presentations, and blog posts. It was designed to award employees for generating leading-edge research and thought-leadership technical content that addresses issues concerning customers in the electronics industry.
The 2019 Paper of the Year award went to Kenneth Thum, Senior Technical Support Engineer, and Sze Pei Lim, Regional Product Manager for Semiconductor Products, for their paper Ultrafine Solder Paste Dispensing for Heterogeneous Integration. The paper examines how heterogeneous integration for advanced packaging is driving the need for ultrafine solder paste dispensing in tightly packed components where printing is not possible. Thum and Lim also offered solutions on how to achieve consistent fine-dot printing, including examining different dispensing equipment technologies and important solder paste characteristics.
Additionally, Bernie Leavitt, Jr., Senior Product Specialist, High-Temperature Engineered Solders, was recognized with an honorable mention award for his outstanding contribution and research paper, The Impact of AuSn Preforms Thickness on Solder Joint Reliability. His paper examines how to overcome the diminishing power of semiconductor lasers as their operational heat increases during use. One technique utilized to counteract this challenge is the application of a thinner 80Au/20Sn solder joint for die-attach to aid in thermal transfer to the copper heat-sinks. Leavitt reviewed the results of a study designed to help engineers gain insight into the optimal preform thickness for laser diode applications, as well as other die-attach applications.
Indium Corporation also thanked Andreas Karch, Regional Technical Manager, and Miloš Lazi?, Technical Support Engineer, for their work advancing materials science and building the company’s technical knowledge and expertise.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
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