Advances in Medical Diagnostics Using LoC and LoPCB Technologies
March 31, 2020 | Pete Starkey and Happy Holden, I-Connect007Estimated reading time: 14 minutes
Basic Components of an LoC
The component devices that make up an LoC are (Figure 3):
- Electrophoresis: Separation columns
- Microfluidics: Channels, valves-pumps & mixers
- Chem-bio detectors and sensors
- Microfluidic chips
Figure 3: LoC elements [1].
1. Electrophoresis
This is a method of separating large molecules (i.e., DNA fragments, blood, or other proteins) from a mixture of similar molecules by passing an electric field toward an electric pole (anode or cathode) in a liquid on various media (e.g., paper, glass, gel, liquid). It is used to separate and purify biomolecules. Each molecule travels through the medium at a different rate—depending on its electrical charge and size—and toward either the anode or the cathode at a characteristic speed (Figure 4).
2. Microfluidics
This custom application of fluidic technology is applied with conventional micromachining techniques, such as wet etching; dry etching; deep, reactive ion etching; sputtering; anodic bonding; and fusion bonding to make flow channels, flow sensors, chemical detectors, separation capillaries, mixers, filters, pumps and valves for various LoCs (Figure 4).
Flow in microchannels is laminar, which allows selective treatment of cells in microchannels, or arrays, as well as biochemical reactions. The integration of microelectronics, micromechanical, and microoptics onto the same substrates allows automated device control, which reduces human error and operation costs.
3. Chem-Bio Detectors and Sensors
Detectors, sensors, and electrodes can be ChemFET and BioFET C-MOS devices with special membranes or diffusions to make them sensitive to chemical or biological molecules. The sensors and electrodes are electrical elements that are sensitive to various chemical or biological molecules, plated with gold, silver, platinum, palladium, etc., and their salts (Figure 5).
4. Microfluidic Chips
A microfluidic chip is a set of microchannels etched or molded into a material (glass, silicon, or polymer, such as PDMS). Microchannels form the microfluidic chip connected in order to achieve the desired features (mix, pump, sort, control bio-chemical environment, etc.). Networks of microchannels are connected to the outside by inputs (inlets) and outputs (outlets) pierced through the chip (interface between the macro and micro world).
Page 2 of 5
Suggested Items
KYZEN to Focus on Aqueous Cleaning and Stencil Cleaning at SMTA Juarez
05/20/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Juarez Expo and Tech Forum, scheduled to take place Thursday, June 5 at the Injectronics Convention Center in Ciudad Jarez, Chihuahua.
Koh Young Installs 24,000th Inspection System at Top 20 EMS
05/14/2025 | Koh YoungKoh Young, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the installation of its 24,000th inspection system at a Top 20 Global EMS in Thailand.
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.