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Elsyca Introduces New Simulation Tools for PCB Copper BalancingApril 6, 2020 | Elsyca
Estimated reading time: 1 minute
Copper plating is a very complex process that is impacted by the PCB design itself, by the panel layout and by the production configuration.
The ever-increasing complexity of the design and request to deliver in shorter amounts of time are even pushing experts to—and over—their limits.
In order to support the different players in this process, Elsyca has developed a new product suite for the PCB industry. One of the products, Elsyca PCBBalance will not only provide detailed information on the layer thickness distribution, but also optimizes PCB designs/panels for manufacturing through intelligent copper balancing.
In regard to copper balancing and its importance, Rick Hartley, Principal Engineer of RHartley Enterprises commented, “Copper balancing should be done, not only at the panel level in PCB FAB, but every PCB designer should be taught the many benefits of copper balancing and incorporate the concepts into their board designs.”
Elsyca’s PCBBalance simulation software allows users to master quality by providing detailed feedback on the layer thickness distribution and on top of that, also by generating the most performant copper balancing with a single mouse click.
The most critical areas on the panel will be identified, focusing testing resources on where they are most needed.
Key features include:
- Identify layer thickness distribution over boards and panels
- Automated and optimized copper balancing
- Identify the most critical holes for post-production quality testing
- Compare different PCB design and panel layouts side by side
- Download copper balancing results
After working for a capital equipment supplier for almost 50 years, I’ve found that the most important part of getting to know your vendor is good communication among all parties. While contact between fabricators of a constantly changing product line and the designers of those products may occur daily or weekly, conversations between you and your equipment supplier may be years apart. That lengthy gap often means that previous contacts may have been promoted, retired, or moved on to other opportunities. You may have also migrated to a new supplier with whom you have little or no history. In either case, you will be interacting with someone you are unfamiliar with (as they are with you). Therefore, it is essential for both sides to communicate clearly so expectations will align.
The opening session of the second day’s conference proceedings focused on global PCB trends and was introduced and moderated by Dr. Michele Stampanoni, vice president of strategic sales and business development at Cicor Group in Switzerland. He opened the session with Dr. Hayao Nakahara’s knowledgeable and enlightening video presentation on the IC substrates industry.
The 2024 Winter Conference of the EIPC took place January 30 and 31 at the IHK Academie in Villingen-Schwenningen, Germany. The keynote session will be reported separately. Here is my review of the first day’s conference proceedings.
Electrodeposition comes down to fundamentals. In the early days of plating, many users considered the nuances of metallization as black magic. Those days are long gone. Having a thorough understanding of the critical parameters that influence electrodeposition will determine success.
High Density Packaging User Group (HDP) is pleased to announce that Shikoku Chemicals Corporation (Shikoku) has become a member.