Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Insituware Appoints New Chief Scientist
April 7, 2020 | Insituware LLCEstimated reading time: 1 minute
Insituware LLC, the provider of the first smart in situ measurement solution with integrated machine learning technology, announces the appointment of Denis Barbini, Ph.D. as Chief Scientist.
Dr. Barbini is an experienced General Director with a demonstrated history of working in the electrical and electronic manufacturing industry. He is skilled in DMAIC, Value Stream Mapping, Failure Mode and Effects Analysis (FMEA), Quality Management, and Root Cause Analysis, and a strong sales professional with a Ph.D. focused in Chemistry, Material Science from State University of New York at Binghamton.
“I’m very excited to be part of the Insituware team,” commented Dr. Barbini. “The company has created a technology that I believe will revolutionize the industry as we know it, and it’s easy to stand behind something you believe in.”
Take control of the materials in your facility with Insituware’s Vision MARK-1 hand-held diagnostic tool. The Vision product family uses machine learning technology to bring material control solutions right in your hand.
The Vision product family is built to last with expandable modules called 'Insights' for a futureproof design, continuously expanding functionality. The first Insight module will allow full monitoring and control of solder paste. This innovative tool will enable rapid, real-time inspection, diagnostics, and process control capabilities.
Insituware will revolutionize the way we control materials!
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.