-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
Designing Proper Work-Life Balance
In this issue, we hear from designers, marketers, and business owners on how they apply their professional skills to their personal lives to build a healthier work-life balance.
Designing Proper Planes
Without planes, designers would have to create thousands of traces to accomplish the same objectives. Power planes provide low impedance and stable power, and ground planes stabilize reference voltage, improve thermal performance, and help preclude EMI issues.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
EMA Design Automation Announces Partnership with Dassault Systèmes
April 8, 2020 | EMA Design AutomationEstimated reading time: 1 minute
EMA Design Automation®, a full-service provider and innovator of Electronic Design Automation (EDA) solutions, announced it has entered into a partnership with Dassault Systèmes that is committed to driving disruptive business transformation for electronic product development. This partnership will work towards the joint mission of connecting teams across a common data model for unified product development and collaboration.
“Our main goal has always been to provide our customers with the right tools, processes, and systems to address their business needs” said Manny Marcano, president and CEO of EMA. “Our electronics expertise combined with the 3DEXPERIENCE® platform allows us to break down traditional communication barriers, providing organizations with a single source of truth to deliver truly differentiated experiences for their customers.”
As product development becomes more complex and intertwined, Dassault Systèmes' 3DEXPERIENCE platform addresses the unique business challenges that arise within the high-tech industry. Traditionally, each phase has been treated as silos of energy, which leads to inefficiencies, multiple revisions, and often missed market opportunities.
The 3DEXPERIENCE platform provides businesses with insight into all phases of the design cycle, naturally connecting the organization in one digital environment. EMA will be providing sales and support for the 3DEXPERIENCE platform. Product teams now have a way to pull together and leverage information from across the organization in context. This unified approach provides stakeholders with the ability to design, simulate, analyze, and verify a true digital twin long before anything is produced; eliminating the need for multiple design iterations prior to production.
For more information about EMA and its partnership with Dassault Systèmes, go to go.ema-eda.com/Dassault or call 585.334.6001.
About EMA Design Automation, Inc.
EMA Design Automation is a trailblazer in product development solutions offering a complete range of EDA tools, PLM integrations, services, training, and technical support. EMA is a Cadence® Channel Partner serving all of North America. EMA develops Ultra Librarian®, TimingDesigner®, CircuitSpace®, CIP™, EDABuilder®, and a host of custom solutions to enhance the OrCAD products, and all are distributed through a worldwide network of value added resellers. EMA is a privately held corporation headquartered in Rochester, New York. Visit EMA at www.ema-eda.com for more information.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Proper Plane Design Techniques
02/12/2026 | I-Connect007 Editorial TeamContinuing our discussion from the November issue of Design007 Magazine on proper plane design, Kris Moyer, an instructor for the Global Electronics Association, shares techniques he teaches his PCB design students to use. When it comes to plane design, there are several challenges with modern high-speed designs. Planes, or more specifically, mirror/return paths, are critical to proper controlled impedance transmission line design. Additionally, to mitigate high-speed switching “noise,” the use of planar capacitance is now necessary and critical.
PCB Design in 2026 and Beyond
02/12/2026 | Filbert Arzola, RaytheonWe asked several experts in PCB design and fabrication about the pressures shaping PCB fabrication today, including speed, density, geopolitics, and relentless technological complexity. The results were valuable insights about where we are, where we’re headed, and importantly, what it will take to get there. Here is Filbert (Fil) Arzola's view of what will be most important and influential for PCB designers going into 2026 and beyond.
EIPC Winter Conference Review: A Focus on Miniaturization
02/12/2026 | Pete Starkey, I-Connect007The theme of the first technical session of EIPC’s Winter Conference in Aix-en-Provence on Feb. 3 was “Miniaturisation and fine-line PCB production: From design to manufacturing.” The session was moderated by EIPC Vice President Thomas Michels, CEO of ILFA in Germany. The theme of the conference is “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” The opening presentation came from applications engineering specialist Dr. Roland Steim of Dyconex in Switzerland, who described how the company has addressed the challenges of miniaturisation and fine-line PCB production.
February Issue of Advanced Electronics Packaging Digest Examines the Evolving Role of Packaging
02/11/2026 | I-Connect007 Editorial TeamI-Connect007 is excited to announce that the upcoming issue of Advanced Electronics Packaging Digest (AEPD) will be delivered to subscriber inboxes on Feb. 16, offering in-depth perspectives on the technologies and system-level thinking shaping the future of electronics packaging. As performance demands rise, advanced packaging is increasingly central to integration across the electronics ecosystem. This issue of AEPD examines how packaging decisions increasingly influence design, materials selection, manufacturing strategy, and overall system performance.
EIPC Winter Conference 2026 Review: The Keynote Sessions
02/11/2026 | Pete Starkey, I-Connect007Aix-en-Provence (pronounced “ex-ahn-pro-vonse”), a historic city and commune in the south of France, about 20 miles north of Marseille, was the pleasant venue for EIPC’s Winter Conference in early February. Industry delegates from 11 European countries, as well as from the U.S. and China, gathered at the Renaissance Hotel for a two-day programme, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” An added attraction was a privileged visit to the ITER fusion power project at the Cadarache research and development centre.