Beyond Design: AI-driven Inverse Stackup Optimization
Global PCB Connections: Following DFM Rules Leads to Better Boards
Elementary Mr. Watson: How to Reinvent Your Professional Journey
EMA Design Automation Announces Partnership with Dassault Systèmes
April 8, 2020 | EMA Design AutomationEstimated reading time: 1 minute
EMA Design Automation®, a full-service provider and innovator of Electronic Design Automation (EDA) solutions, announced it has entered into a partnership with Dassault Systèmes that is committed to driving disruptive business transformation for electronic product development. This partnership will work towards the joint mission of connecting teams across a common data model for unified product development and collaboration.
“Our main goal has always been to provide our customers with the right tools, processes, and systems to address their business needs” said Manny Marcano, president and CEO of EMA. “Our electronics expertise combined with the 3DEXPERIENCE® platform allows us to break down traditional communication barriers, providing organizations with a single source of truth to deliver truly differentiated experiences for their customers.”
As product development becomes more complex and intertwined, Dassault Systèmes' 3DEXPERIENCE platform addresses the unique business challenges that arise within the high-tech industry. Traditionally, each phase has been treated as silos of energy, which leads to inefficiencies, multiple revisions, and often missed market opportunities.
The 3DEXPERIENCE platform provides businesses with insight into all phases of the design cycle, naturally connecting the organization in one digital environment. EMA will be providing sales and support for the 3DEXPERIENCE platform. Product teams now have a way to pull together and leverage information from across the organization in context. This unified approach provides stakeholders with the ability to design, simulate, analyze, and verify a true digital twin long before anything is produced; eliminating the need for multiple design iterations prior to production.
For more information about EMA and its partnership with Dassault Systèmes, go to go.ema-eda.com/Dassault or call 585.334.6001.
About EMA Design Automation, Inc.
EMA Design Automation is a trailblazer in product development solutions offering a complete range of EDA tools, PLM integrations, services, training, and technical support. EMA is a Cadence® Channel Partner serving all of North America. EMA develops Ultra Librarian®, TimingDesigner®, CircuitSpace®, CIP™, EDABuilder®, and a host of custom solutions to enhance the OrCAD products, and all are distributed through a worldwide network of value added resellers. EMA is a privately held corporation headquartered in Rochester, New York. Visit EMA at www.ema-eda.com for more information.
Share on:
Suggested Items
SP Manufacturing Expands with New Malaysia Plant, Acquires Ideal Jacobs
12/26/2024 | PRNewswireSP Manufacturing (SPM), a leader in Electronic Manufacturing Services (EMS), is strengthening its global presence with two major moves: opening a new manufacturing facility in Senai, Malaysia, and successfully acquiring Ideal Jacobs Corporation.
Robosys, ACUA Ocean + OREC Secure Funding For Collaborative Autonomy Project
12/25/2024 | RobosysAdvanced maritime autonomy developer, Robosys Automation, supported by USV manufacturer, ACUA Ocean, and Offshore Renewable Energy Catapult (OREC), have jointly secured grant funding through Innovate UK.
IPC Announces New Training Course: PCB Design for Military & Aerospace Applications
12/23/2024 | IPCIPC announced the launch of a new training course: PCB Design for Military & Aerospace Applications.
Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
Beyond Design: AI-driven Inverse Stackup Optimization
12/26/2024 | Barry Olney -- Column: Beyond DesignArtificial intelligence (AI) is transforming how we conceptualize and design everything from satellites to PCBs. Traditionally, stackup planning is a manual process that can be multifaceted and relies heavily on the designer's expertise. Despite having best practices and various field solvers to optimize parameters, stackup planning remains challenging for complex designs with advanced packaging, several layers, multiple power pours, and controlled impedance requirements.