The Shaughnessy Report: A Stack of Advanced Packaging Info
Connect the Dots: Designing for Reality: Strip-Etch-Strip
Dana on Data: Merging 2D Electrical, 3D Mechanical Worlds
EMA Design Automation Announces Partnership with Dassault Systèmes
April 8, 2020 | EMA Design AutomationEstimated reading time: 1 minute
EMA Design Automation®, a full-service provider and innovator of Electronic Design Automation (EDA) solutions, announced it has entered into a partnership with Dassault Systèmes that is committed to driving disruptive business transformation for electronic product development. This partnership will work towards the joint mission of connecting teams across a common data model for unified product development and collaboration.
“Our main goal has always been to provide our customers with the right tools, processes, and systems to address their business needs” said Manny Marcano, president and CEO of EMA. “Our electronics expertise combined with the 3DEXPERIENCE® platform allows us to break down traditional communication barriers, providing organizations with a single source of truth to deliver truly differentiated experiences for their customers.”
As product development becomes more complex and intertwined, Dassault Systèmes' 3DEXPERIENCE platform addresses the unique business challenges that arise within the high-tech industry. Traditionally, each phase has been treated as silos of energy, which leads to inefficiencies, multiple revisions, and often missed market opportunities.
The 3DEXPERIENCE platform provides businesses with insight into all phases of the design cycle, naturally connecting the organization in one digital environment. EMA will be providing sales and support for the 3DEXPERIENCE platform. Product teams now have a way to pull together and leverage information from across the organization in context. This unified approach provides stakeholders with the ability to design, simulate, analyze, and verify a true digital twin long before anything is produced; eliminating the need for multiple design iterations prior to production.
For more information about EMA and its partnership with Dassault Systèmes, go to go.ema-eda.com/Dassault or call 585.334.6001.
About EMA Design Automation, Inc.
EMA Design Automation is a trailblazer in product development solutions offering a complete range of EDA tools, PLM integrations, services, training, and technical support. EMA is a Cadence® Channel Partner serving all of North America. EMA develops Ultra Librarian®, TimingDesigner®, CircuitSpace®, CIP™, EDABuilder®, and a host of custom solutions to enhance the OrCAD products, and all are distributed through a worldwide network of value added resellers. EMA is a privately held corporation headquartered in Rochester, New York. Visit EMA at www.ema-eda.com for more information.
Share on:
Suggested Items
The Shaughnessy Report: A Stack of Advanced Packaging Info
12/10/2024 | Andy Shaughnessy -- Column: The Shaughnessy ReportIt’s only fitting that this issue on advanced packaging and stackup features a “stackup” of “packages” on the cover. There’s certainly a lot to “unpack” in this issue. As advanced packaging moves further into the mainstream of PCB design, more PCB designers and design engineers are realizing this isn’t a plug-and-play technology. As we see in this issue, advanced packaging can have an impact on the entire design—the stackup in particular.
I-Connect007 Releases New Episode of Meet the Author Podcast: Spotlight on Complex PCB Design
12/10/2024 | I-Connect007I-Connect007 is thrilled to announce the latest installment of its Meet the Author podcast series, hosted by Nolan Johnson. In this episode, Johnson interviews Scott Miller and Brian White of Freedom CAD, who share their expertise on complex PCB design.
Advanced Packaging and Stackup Design: December 2024—Design007 Magazine
12/09/2024 | I-Connect007 Editorial TeamIn this month's issue,, we asked our expert contributors to discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in the arena of HDI and UHDI. And with a little research, planning, and collaboration with the fabricator, any seasoned PCB designer can utilize advanced packaging.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/06/2024 | Marcy LaRont, I-Connect007This week’s must-reads include a discussion on innovation and embedded components within the layers of a PCB with Accurate Circuit Engineering. We revisit the real cost to manufacture in a case study on how a seemingly small design error can have a dramatic effect on your end customer’s costs. Dan Beaulieu provides this month’s book review highlighting the criticality of fostering creativity in the workplace. Bert Horner of The Test Connection discusses his decision to launch a new, complimentary business venture, The Training Connection; and Ramon Roche of NCAB talks about electric vehicle charging.
If You Can Define It Right, You Can Design It Right
12/05/2024 | Andy Shaughnessy, Design007Design engineer Chris Young is known for his optimized design process. As lead hardware engineer with Moog Space and Defense Group and owner of Young Engineering Services, Chris collects data like it’s going out of style, and he leaves nothing to chance. With that in mind, I asked Chris to discuss his views on rules of thumb—which ones work, which ones should be avoided, and how rules fit ideally into the PCB design process.