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Analog Devices Launches ADVentures, a New Corporate Venture Capital Fund

06/21/2025 | Analog Devices, Inc.
Analog Devices, Inc. (ADI) announced the launch of ADVentures (ADV), a corporate venture capital (CVC) fund focused on identifying and investing in emerging opportunities that will define new frontiers in innovation and impact.

Keysight, Synopsys Deliver an AI-Powered RF Design Migration Flow

06/06/2025 | BUSINESS WIRE
Keysight Technologies, Inc. and Synopsys, Inc. introduced an AI-powered RF design migration flow to expedite migration from TSMC’s N6RF+ process to N4P technology, to address the performance requirements of today’s most demanding wireless integrated circuit applications.

Material Selection and RF Design

04/21/2025 | Andy Shaughnessy, Design007 Magazine
Innovation rarely sleeps in this industry, and the RF laminate segment offers a perfect example. RF materials have continued to evolve, providing PCB designers much more than an either/or choice. I asked materials expert Alun Morgan, technology ambassador for the Ventec International Group, to walk us through the available RF material sets and how smart material selection can ease the burden on RF designers and design engineers.

TI Introduces the World's Smallest MCU, Enabling Innovation in the Tiniest of Applications

03/12/2025 | PRNewswire
Texas Instruments (TI) introduced the world's smallest MCU, expanding its comprehensive Arm® Cortex®-M0+ MSPM0 MCU portfolio. Measuring only 1.38mm2, about the size of a black pepper flake, the wafer chip-scale package (WCSP) for the MSPM0C1104 MCU enables designers to optimize board space in applications such as medical wearables and personal electronics, without compromising performance.

MediaTek Adopts AI-Driven Cadence Virtuoso Studio and Spectre Simulation on NVIDIA Accelerated Computing Platform for 2nm Designs

01/27/2025 | Cadence Design Systems
Cadence announced that MediaTek has adopted the AI-driven Cadence® Virtuoso® Studio and Spectre® X Simulator on the NVIDIA accelerated computing platform for its 2nm development.
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