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Ventec's Chicago (USA) Facility Receives ISO 9001:2015 CertificationApril 15, 2020 | Ventec International Group
Estimated reading time: 1 minute
Ventec International Group Co., Ltd. has achieved ISO 9001:2015 certification for its Quality Management System at its US-facility in Chicago, following an audit by certifying body Intertek.
ISO 9001:2015 sets out the criteria for a quality management system and is based on a number of quality management principles including a strong customer focus, the motivation and implication of top management, the process approach and continual improvement. The excellent professional support from Steve Williams from TracQMS and the hard work put in by Ventec's Operations Manager Israel Cadenas and the entire Ventec Chicago staff was rewarded with a perfect certification audit. Ventec's Fullerton facility is next up on the ISO certification agenda.
"I am very proud to receive this certification at the Chicago facility without any instances of non-conformity," said Jack Pattie, President Ventec (USA). "It recognizes the hard work of Steve, Israel and our entire team and confirms the success of our quality strategy for the benefit of all our customers."
"Ventec maintains robust quality management systems in all its facilities around the world including AS9100 Rev D and IATF 16949:2016, ensuring that all our customers receive reliable, consistent, good quality products and services from us through our fully controlled global supply chain," said Mark Goodwin, COO Europe & Americas.
Ventec International is a world leader in the production of polyimide and high reliability epoxy laminates and prepregs and specialist provider of thermal management and IMS solutions.
For more information about Ventec's solutions and the company's wide variety of products, please visit www.venteclaminates.com.
About Ventec International Group
Ventec International Group Co., Ltd. (6672 TT) is a premier supplier to the Global PCB industry. With volume manufacturing facilities in Taiwan and China and distribution locations and manufacturing sites in both the US and Europe, Ventec specializes in advanced copper clad glass reinforced and metal backed substrates. Ventec materials, which include high-quality enhanced FR-4, high-speed/low-loss- and high-performance IMS material technology and an advanced range of thermal management solutions, are manufactured by Ventec using strict quality-controlled processes that are certified to AS9100 Revision D, IATF 16949:2016 and ISO 9001:2015, and are backed by a fully controlled and managed global supply chain, sales- and technical support-network. For more information, visit www.venteclaminates.com.
After working for a capital equipment supplier for almost 50 years, I’ve found that the most important part of getting to know your vendor is good communication among all parties. While contact between fabricators of a constantly changing product line and the designers of those products may occur daily or weekly, conversations between you and your equipment supplier may be years apart. That lengthy gap often means that previous contacts may have been promoted, retired, or moved on to other opportunities. You may have also migrated to a new supplier with whom you have little or no history. In either case, you will be interacting with someone you are unfamiliar with (as they are with you). Therefore, it is essential for both sides to communicate clearly so expectations will align.
The opening session of the second day’s conference proceedings focused on global PCB trends and was introduced and moderated by Dr. Michele Stampanoni, vice president of strategic sales and business development at Cicor Group in Switzerland. He opened the session with Dr. Hayao Nakahara’s knowledgeable and enlightening video presentation on the IC substrates industry.
The 2024 Winter Conference of the EIPC took place January 30 and 31 at the IHK Academie in Villingen-Schwenningen, Germany. The keynote session will be reported separately. Here is my review of the first day’s conference proceedings.
Electrodeposition comes down to fundamentals. In the early days of plating, many users considered the nuances of metallization as black magic. Those days are long gone. Having a thorough understanding of the critical parameters that influence electrodeposition will determine success.
High Density Packaging User Group (HDP) is pleased to announce that Shikoku Chemicals Corporation (Shikoku) has become a member.