-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssuePower Integrity
Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
Signal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Flexible Circuit Technologies: ‘We Do it All’
April 16, 2020 | Dan Beaulieu, D.B. Management GroupEstimated reading time: 2 minutes

During IPC APEX EXPO 2020 in San Diego, Carey Burkett, VP of Flexible Circuit Technologies, sat down for an interview with Dan Beaulieu. The two discussed the company’s expansive growth, the current flex and rigid-flex landscape, and FCT’s drive to provide complete solutions from rigid and flex circuits through box build.
Dan Beaulieu: Good morning. Today, I’m pleased to talk to my friend Carey Burkett from Flexible Circuit Technologies in Minneapolis, Minnesota. Carey, thanks for being with me today.
Carey Burkett: Thanks for having me, Dan.
Beaulieu: This is a very interesting company that I’ve gotten to know in the last few months and one of the fast-growing success stories in North America. You’re a global company; I want to learn a little more about that. Carey, what can you tell me about your company?
Burkett: First of all, Flexible Circuit Technologies is a supplier of flexible circuits, rigid-flex, flexible heaters, and membrane switches, and then we also do specialized EMS assembly services all the way to complete box builds. We do it all.
Beaulieu: Is it true that your company started out doing just flexible circuits?
Burkett: Yes. In fact, that’s very important in today’s marketplace. Flex and rigid-flex are growing extremely rapidly. Engineers are being forced into those technologies due to a wide array of topics, whether it’s miniaturization, mobility, or connectivity. There are all kinds of reasons. Engineers across all markets are being driven to flexible solutions. One of the things that’s interesting is that it’s growing so rapidly that there are many new entrants into that market. Unfortunately, there’s a lack of true design talent in the industry.
Beaulieu: Correct. That’s a fact.
Burkett: One of the things that is unique about us is the application engineering support that we provide to our customers. We’re led by Mark Finstad. Mark co-chairs the IPC Flex Circuit 2223 Design Committee. He’s well known and the lead educator, along with another gentleman, at IPC events. Mark is also a noted columnist and one of the foremost experts on the globe, and yet it’s not just Mark. Our entire team of application engineers offers from 25 to 35 years of experience in designing flex and rigid-flex. It’s so important in helping customers get to cost-effective designs that are going to perform within the challenging applications that these circuits are typically used in.
To read this entire interview, which appeared in the March 2020 issue of Design007 Magazine, click here.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.