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Call for Participation: Cleaning and Conformal Coating Conference
April 17, 2020 | IPC and SMTAEstimated reading time: Less than a minute
Share your expertise on cleaning and coating issues at the High Reliability Cleaning and Conformal Coating Conference, presented by IPC and SMTA. November 3-5, Dallas, TX.
The High Reliability Cleaning and Conformal Coating Conference covers technological developments in strategies to achieve surface reliability, through technical presentations, tutorials, tabletop exhibits and networking events. Professional Development courses will take place on November 3, and the Technical Conference will take place November 4–5.
We invite you to submit an abstract for a professional development course or a technical presentation. This conference will address the many facets of this topic including:
- Electrical Performance and Reliability
- Cleaning Process Design
- Maintaining and Monitoring the Cleaning Process
- Material Choices and Compatibility
- Conformal Coatings
- Supply Chain Management “When Failure is NOT an Option”
IMPORTANT DATES
Abstract Submission Deadline: July 10
Notification of Acceptance: August 1
Presentation Submissions Deadline: October 13
Conference: November 3–5
Submit your abstract by July 10, 2020 by emailing Brook Sandy-Smith, BrookSandy@ipc.org, IPC technical conference program manager.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.