Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Juki Introduces Game-Changing TAKUMI Head
April 17, 2020 | Juki Automation Systems (JAS), Inc.Estimated reading time: Less than a minute
Juki Automation Systems (JAS), Inc., a world-leading provider of automated assembly products and systems and subsidiary of Juki Corporation, is proud to offer the new, game-changing TAKUMI head, which is a dynamic height 8-nozzle placement head that automatically adjusts its height on the fly to optimize placement speed.
The TAKUMI head eliminates the need to replace placement heads for different types of components to be placed, and minimizes Z travel during component pickup and placement. Cycle time is optimized by keeping the head as close to the PCB as possible. The TAKUMI head is available on JUKI’s award-winning RS-1s and JM-100s.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Light-curable Solutions for Reliable Electronics in Space Applications
10/15/2025 | Virginia Hogan, DymaxDesigning electronics for space environments, particularly those in low Earth orbit (LEO), requires careful consideration of materials that can withstand extreme conditions while supporting long-term reliability. Engineers designing satellite systems, aerospace instrumentation, and high-altitude platforms face a familiar set of challenges: contamination control, mechanical stress, thermal cycling, and manufacturability.
Elementary, Mr. Watson: High Power: When Physics Becomes Real
10/15/2025 | John Watson -- Column: Elementary, Mr. WatsonHave you ever noticed how high-speed design and signal integrity classes are always packed to standing room only, but just down the hall, the session on power electronics has plenty of empty chairs? It's not just a coincidence; it's a trend I've observed over the years as both an attendee and instructor.
Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics SolutionsAs power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).
Bluepath Robotics Optimizes AMR Fleets with Inductive Charging Solution from Wiferion
10/09/2025 | WiferionIn a dynamic and highly competitive industry such as logistics, efficient and uninterrupted material flows are of crucial importance. To ensure maximum uptime for its robots, Bluepath Robotics, which specializes in autonomous mobile robots (AMR), needed a reliable and powerful power supply.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.