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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Henger Captivates the 2026 JPCA SHOW in Japan with Next‑Generation Plasma Technolog

06/19/2026 | Henger
From June 10–12, 2026, Henger Microelectronics made a powerful appearance at the JPCA SHOW in Tokyo — one of the world’s most influential exhibitions for the electronic circuit and advanced packaging industries.

Flexible Circuit Technologies Expands Global Manufacturing Footprint with Thailand Operations

06/10/2026 | Flexible Circuit Technologies
Flexible Circuit Technologies (FCT), a leading global provider of flexible circuit design, advanced interconnect solutions, and electronics manufacturing services, today announced the expansion of its manufacturing capabilities into Thailand, further strengthening its global supply chain and production network. 

Qnity Introduces Enhanced Advanced Packaging Materials for Organic Interposer Applications

06/09/2026 | Qnity
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, introduced enhanced advanced packaging material solutions for organic interposer applications:

Technica USA Welcomes ASMPT Support Team for SIPLACE SX Demo Days Event

06/05/2026 | Technica USA
Technica USA, in partnership with ASMPT, hosted a successful Demo Days event this week at its San Jose facility.

American Standard Circuits to Exhibit at IMS 2026 in Boston

06/02/2026 | American Standard Circuits
Anaya Vardya, President and CEO of American Standard Circuits, has announced that the company will be exhibiting at IMS 2026, the world’s leading event for RF, microwave, and high-frequency technologies, taking place June 8th through June 13th, 2026, at the Thomas M. Menina Convention and Exhibition Center in Boston, Massachusetts.
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