-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueSilicon to Systems: From Soup to Nuts
This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
Cost Drivers
In this month’s issue of Design007 Magazine, our expert contributors explain the impact of cost drivers on PCB designs and the need to consider a design budget. They discuss the myriad design cycle cost adders—hidden and not so hidden—and ways to add value.
Mechatronics
Our expert contributors discuss the advent of mechatronics in PCB design, the challenges and opportunities this creates for circuit board designers, and the benefits—to the employee and the company—of becoming a mechatronics engineer.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
IPC Issues Call for Participation for High-Reliability Cleaning and Conformal Coating Conference
April 21, 2020 | IPCEstimated reading time: 1 minute
IPC invites experts in all areas of cleaning and coating for electronic assemblies to submit technical conference abstracts for the High-Reliability Cleaning and Conformal Coating Conference, presented by IPC and SMTA, to be held November 3-5, 2020 in Dallas, Texas.
The goal of this conference is to enable electronics assemblers to address cleaning and coating issues by showcasing industry knowledge covering technological developments in strategies to achieve surface reliability. This conference features technical presentations, tutorials, tabletop exhibits and networking events. Professional development courses will take place on November 3, and the technical conference will take place November 4–5.
Expert technical presentations are being sought in the following areas:
- Electrical Performance and Reliability
- Cleaning Process Design
- Maintaining and Monitoring the Cleaning Process
- Material Choices and Compatibility
- Conformal Coatings
- Supply Chain Management
An approximate 300-word technical conference abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted. The abstract should be technical in nature and must clearly state the topical content and benefits to the participants. Programs and presentations must be non-commercial, original work. Abstracts should include a title and short description of at least 30 words.
Abstracts can be sent to Brook Sandy-Smith, IPC technical conference program manager, at BrookSandy@ipc.org.
To sponsor or exhibit at this event, contact Alicia Balonek, IPC senior director of tradeshows & events, at AliciaBalonek@ipc.org.
About IPC
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 5,800 member-company sites which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices Washington, D.C.; Atlanta, Ga.; Miami, Fla.; Brussels, Belgium; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
Suggested Items
Making Waves With Solder Paste Jetting
09/11/2024 | Josh Casper, Horizon SalesAs electronics shrink and PCB density grows, traditional solder deposition methods such as stencil printing face significant challenges. One solution making substantial waves is solder paste jetting. Solder paste jetting is no secret. In fact, the development and commercialization of this technology has been around since the early 2000s. So, why now? We’ve arrived at a time in which the maturity of this technology has intersected with new demands of electronics manufacturing.
Register Now for NEDME 2024
09/11/2024 | NEDMEThe Northwest Electronics Design & Manufacturing Expo (NEDME) is back for another year of innovation, collaboration, and industry-leading insights. On Wednesday, October 30, 2024, join professionals from the electronics design and manufacturing sector at the Wingspan Event & Conference Center for a full day of cutting-edge exhibits, expert speakers, and unparalleled networking opportunities.
Wearable Technology Market to Grow by $87.3 Billion from 2024-2028
09/10/2024 | PRNewswireReport on how AI is redefining market landscape- The global wearable technology market size is estimated to grow by USD 87.3 billion from 2024-2028, according to Technavio.
Tata Electronics, ASMPT Partner for India Semiconductor Growth
09/10/2024 | PRNewswireIn a significant step towards accelerating its readiness for its semiconductor assembly and test facilities in Vemagal, Karnataka and Jagiroad, Assam, Tata Electronics signs a Memorandum of Understanding (MOU) with ASMPT Singapore to collaborate on establishing semiconductor assembly equipment infrastructure and solutions.
A Parametric Approach to the Environmental Impact of PCB Fabrication
09/09/2024 | Maarten Cauwe, imecSustainability for electronics is receiving more attention due to environmental concerns, regulatory obligations, and to ensure competitiveness in a growing market for sustainable products. To facilitate the discussion on the environmental impact of electronics, there is a strong need for data on energy use, carbon footprint, greenhouse gas (GHG) emissions, hazardous chemicals used during manufacturing, waste generation, etc.